Using a new method for precisely controlling the deposition of carbon, researchers have demonstrated a technique for connecting multi-walled carbon nanotubes to the metallic pads of integrated circuits without the high interface resistance produced by traditional fabrication techniques.
In the relatively new scientific frontier of topological insulators, theoretical and experimental physicists have been studying the surfaces of these unique materials for insights into the behavior of electrons that display some very un-electron-like properties.
A multinational research team has discovered filamentous bacteria that function as living power cables in order to transmit electrons thousands of cell lengths away.
Scientists in the Advanced Materials and Nanosystems directorate at the Lockheed Martin Space Systems Advanced Technology Center (ATC) in Palo Alto have developed a revolutionary nanotechnology copper-based electrical interconnect material, or solder, that can be processed around 200 °C. Once fully optimized, the CuantumFuse™ solder material is expected to produce joints with up to 10 times the electrical and thermal conductivity compared to tin-based materials currently in use. Applications in military and commercial systems are currently under consideration.
Ultratech, a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today introduced its new in-line wafer inspection system, the Superfast 3G, which provides the flexibility to address a wide range of applications including improved overlay control and enhanced yield.
STMicroelectronics, Soitec (Euronext) and CMP (Circuits Multi Projets®) today announced that ST's CMOS 28nm Fully Depleted Silicon-On-Insulator (FD-SOI) process, which uses innovative silicon substrates from Soitec, is now available for prototyping to universities, research labs and design companies through the silicon brokerage services provided by CMP. ST is releasing this process technology to third parties as it nears completion of its first commercial wafers.
Nano-ribbons of silicon configured so the atoms resemble chicken wire could hold the key to ultrahigh density data storage and information processing systems of the future.
The College of Nanoscale Science and Engineering (CNSE) of the University at Albany announced today that its Smart System Technology and Commercialization Center of Excellence (STC) in Rochester has received the critical and prestigious designation as a Trusted Foundry – Aggregator by the U.S. Department of Defense’s (DoD) Defense Microelectronics Agency.
Case Western Reserve University researchers have won a $1.2 million grant to develop technology for mass-producing flexible electronic devices at a whole new level of small.
Berkeley Design Automation, provider of the world’s fastest nanometer circuit verification, today announced that TSMC has incorporated the Analog FastSPICE Platform in its Custom Design Reference Flow for 20nm Device Noise Analysis and Circuit-Specific Process Corners.
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