Nanoelectronics News

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ARM, GLOBALFOUNDRIES Announce Launch of 28 nm SoC Test Chip

ARM and GLOBALFOUNDRIES have introduced the first-its-kind 28 nm dual-core Cortex-A9 processor-based SoC test chip operating at over 2.5 GHz frequency. They have also announced the tape out of Cortex-A9 processor-based SoCs utilizing 20 nm technology qualification vehicle (TQV) of GLOBALFOUNDRIES.

From GlobalFoundries 16 Dec 2011

GLOBALFOUNDRIES Achieves Silicon Success for 20 nm Chip Using Synopsys’ IC Compiler-AG

Synopsys has declared that GLOBALFOUNDRIES has achieved silicon success for its first major 20 nm chip using Synopsys’ IC Compiler-Advanced Geometry (AG), which is the 20-nm version of IC Compiler.

From GlobalFoundries 16 Dec 2011

STMicroelectronics Produces World's First Semiconductor Wafer Using EMWS Technology

STMicroelectronics has declared that it has successfully produced first-of-its-kind semiconductor wafer, whose dice were completely tested devoid of contact probes.

From STMicroelectronics 16 Dec 2011

eSilicon Licenses 40 nm Silicon-Proven TCAM Macros to HiSilicon Technologies

HiSilicon Technologies, a company specializing in semiconductor designs for consumer electronics and communication industries, has become the licensee of eSilicon’s 40 nm silicon-proven ternary content-addressable memory (TCAM) macros for use in its future-generation, superior-performance network-application ASICs.

16 Dec 2011

Vorbeck Materials Secures Fund to Expand Sales of Graphene-Based Vor-ink for Printed Electronics

Vorbeck Materials has declared that it has wrapped up a completely subscribed series 3 funding with a total amount of $10 million. The funding was completed on 9 December 2011. Fairbridge Venture Partners and Black Powder were the companies which led the funding that also comprised 15 more investors.

From Vorbeck Materials 15 Dec 2011

FSI International Obtains Follow-On Orders for ORION Single Wafer and ANTARES Cryokinetic Cleaning Systems

FSI International, a provider of surface conditioning devices for the production of microelectronics, has declared that a major semiconductor manufacturer has placed a follow-on order for the company’s ORION single wafer cleaning system for back-end-of-line applications.

15 Dec 2011

Graphene-Based Inkjet Printing Method Helps Advance Printed Electronics

A research team led by Dr. Woo Lee, who serves at Stevens Institute of Technology’s Schaefer School of Engineering and Science at the Department of Chemical Engineering and Materials Science’s George Meade Bond Professor, has exhibited its novel graphene-based method for inkjet printing of energy storage devices, paving the way for the advancement of printed electronics.

13 Dec 2011

Study Demonstrates Benefits of FD-SOI Technology for 20 and 28 nm Process Nodes

According to a joint research carried out by GLOBALFOUNDRIES, ARM. IBM, STMicroelectronics and other major semiconductors firms for producing 28 nm chips using fully depleted silicon-on-insulator (FD-SOI) process, planar semiconductor devices built on FD-SOI substrates are capable of delivering significant performance and power benefits when compared to CMOS devices fabricated on bulk-silicon substrates.

From GlobalFoundries 13 Dec 2011

MULT-EU-SIM Pushes For European Commision on Nanoelectronics Modelling

MULT-EU-SIM aims to gather the simulation research community in Europe to establish a joint vision of multiscale modelling and simulation. This will enable to prepare Europe to play a leading role in the opening era of c...

12 Dec 2011

GLOBALFOUNDRIES Certifies Synopsys’ IC Validator for 65, 40, 28 nm Process Nodes

Synopsys has declared that its physical verification product, IC Validator has been certified by GLOBALFOUNDRIES for 65, 40 and 28 nm physical signoff, with immediate accessibility to layout-versus-schematic and design rule check runsets to customers of GLOBALFOUNDRIES.

From GlobalFoundries 12 Dec 2011

Nanoelectronics News

ARM, GLOBALFOUNDRIES Announce Launch of 28 nm SoC Test Chip

GLOBALFOUNDRIES Achieves Silicon Success for 20 nm Chip Using Synopsys’ IC Compiler-AG

STMicroelectronics Produces World's First Semiconductor Wafer Using EMWS Technology

eSilicon Licenses 40 nm Silicon-Proven TCAM Macros to HiSilicon Technologies

Vorbeck Materials Secures Fund to Expand Sales of Graphene-Based Vor-ink for Printed Electronics

FSI International Obtains Follow-On Orders for ORION Single Wafer and ANTARES Cryokinetic Cleaning Systems

Graphene-Based Inkjet Printing Method Helps Advance Printed Electronics

Study Demonstrates Benefits of FD-SOI Technology for 20 and 28 nm Process Nodes

MULT-EU-SIM Pushes For European Commision on Nanoelectronics Modelling

GLOBALFOUNDRIES Certifies Synopsys’ IC Validator for 65, 40, 28 nm Process Nodes

Combining Nanofluids and Turbulators for Sustainable Energy

Enhancing Material Properties through Nanotube Encapsulation

Brain-Inspired Nano-Tech Promises New Era for Electronics

Breakthrough in 2D Material Growth Opens Doors to Cleaner Energy and Next-Generation Technology

Sustainable ZnO Nanoparticles for Methylene Blue Cleanup

Electrospinning and the Future of Nanotechnology

How Electrospinning is Shaping the Future of Nanotechnology

Conversations on AFM: Applications of BioAFM in Life Science

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