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New Synthesis Route May Pave the Way for Graphene to Used in Next Generation Electronics

Researchers at UC Santa Barbara have discovered a method to synthesize high quality graphene in a controlled manner that may pave the way for next-generation electronics application.

17 Oct 2011

Altera Combines FPG and ARM Processor into 28 nm Single Chip System

US-based Altera has announced that it has launched its new series of SoC FPGA, which is on the ARM technology. The SoC FPGA combines the dual core ARM Cortex-A9 MPCore Processor, 28 nm Cyclone V and Arria V FPGA fabric, high bandwidth interconnect, peripherals and error correcting code (ECC) secured memory controllers.

13 Oct 2011

ASSID Uses Alcatech’s AltaCVD 300 System for IC Pilot Manufacture

Fraunhofer IZM Institute’s microelectronic wafer level packaging and system integration centre, All Silicon System Integration Dresden (ASSID) will use the AltaCVD 300 System from Altatech Semiconductor for its single wafer 3D semiconductors.

13 Oct 2011

CHAD Industries Completes Shipment of Automated Wafer Handling Workcell to Asymtek

CHAD Industries has announced the completion of multiple shipments of its automated wafer handling workcell called WaferMate300-2 for the S-930 dispensing tool, the latest dispensing platform of Asymtek.

12 Oct 2011

Research and Markets Releases Report on Nanoscale Semiconductor-on-Insulator Materials

Online research website Research and Markets has released a report titled “Nanoscaled Semiconductor-on-Insulator Materials, Sensors and Devices”.

10 Oct 2011

STATS ChipPAC to Use Advanced Fan-out Wafer Technology for Semiconductor Market

US-based STATS ChipPAC, which specialises in providing advanced packaging and semiconductor test services has announced that it will cater to a wide range of the semiconductor markets including media tablets, smartphones and cloud computing-based applications by using its fan-out wafer level packaging (FO-WLP) technology.

10 Oct 2011

ARM Artisan Physical IP Solutions for UMC’s 28nm Process Technology

ARM and semiconductor foundry UMC have signed a long term agreement under which UMC will use the ARM Artisan Physical IP solutions for its 28nm process technology.

10 Oct 2011

Adapteva Releases 28 nm 64 RISC Core Epiphany-IV Microprocessor Chip

The semiconductor technology company located in Lexington, Massachusetts, Adapteva has revealed the 4th generation Epiphany multicore architecture IP in 28 nm chip design.

7 Oct 2011

Rudolph Delivers Wafer Scanner and Macro Defect Inspection Systems to Semiconductor Manufacturer

Rudolph Technologies proclaimed that it has delivered its multiple NSX Macro Defect Inspection Systems, Wafer Scanner 3880 3D Inspection System and Discover Yield Management Software Suite to a major semiconductor manufacturing company for developing sophisticated three-dimensional IC integration using through silicon via (TSV) based processes.

From Onto Innovation 7 Oct 2011

Nanoinformatics 2011 Announce Call for Posters

Nanoinformatics 2011 will bring together informatics experts, nanotechnology researchers, and other stakeholders and potential contributors to advance Nanoinformatics 2020 Roadmap goals. The workshop will set a clear pat...

6 Oct 2011