ASSID Uses Alcatech’s AltaCVD 300 System for IC Pilot Manufacture

Fraunhofer IZM Institute’s microelectronic wafer level packaging and system integration centre, All Silicon System Integration Dresden (ASSID) will use the AltaCVD 300 System from Altatech Semiconductor for its single wafer 3D semiconductors.

The 300 mm CVD system from Altatech is being used by ASSID to deposit conformal dielectric liners inside through silicon vias (TSV) for the creation of latest 3D ICs and devices that have a system-in-package. The TSVs that are used for this process have a diameter of 10 µm and an aspect ratio of 10:1.

In order to enhance the functionalities of a single packaged device, ASSID is in the process of developing, assembling and integrating 3D technologies. 3D semiconductors are capable of high speed communication and low power consumption within a small chip. These features make it ideal for usage in various applications such as security, image and mobile electronics. According to Jean-Luc Delcarri who is the President of Alcatech Semiconductor, the company’s CVD system has the capability of operating under low temperatures and the ability to include wafers of 200 and 300 mm without the need to change hardware in the chamber. This feature has found great demand among semiconductor manufacturers and R&D labs. The ASSID was started in May 2010 with specific focus on designing and developing projects based on 3D 200 / 300 mm wafer level system integration and for the development of a prototype.