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Professor Wins International Award for Research on Nanotechnology Applications in Electronic Industry

Russian-born Alexander Balandin, a professor of electrical engineering at the University of California, Riverside's Bourns College of Engineering will be bestowed with an international award in acknowledgement of his research in nanotechnology that can be applied in electronic devices.

From University of California at Riverside 26 Apr 2011

Joint Venture to Develop NAND Nano-scale Flash Memory

Intel and Micron Technology have jointly unveiled IM Flash Singapore. The US$3 billion unit will hire 1200 persons and manufacture the company' 25nm NAND Flash memory.

From Micron Technology, Inc. 25 Apr 2011

Taoyuan to Host Global Conference on Nanoelectronics

The 4th IEEE International NanoElectronics Conference (INEC 2011) being held in Taoyuan, between June 21 and 24, will study the main nanomaterials applications in electronics, photonics and biology. Papers on research by...

25 Apr 2011

Nanotechnology-based Flash Memory Chips for Mobile Phones

California-based SanDisk, a developer of flash memory cards, has unveiled a 64-Gb, 2-bits/cell based monolithic chip based on 19nm technology.

25 Apr 2011

Nano-scale Flash Chips for Data Warehousing

Texas Memory Systems has opted for Toshiba’s advanced 32nm SLC Flash chips to be applied in its storage devices. The chips will allow the company to reduce overall costs of its RamSan-630 by 15%.

25 Apr 2011

Magnetic Nano-particle Tower for Two-fold Data Storage

A French research team has discovered how to increase areal density of data two-fold by fragmenting the magnetic medium into nano-particles to create a three-dimensional tower.

25 Apr 2011

Nano-scale Transistor for Quantum Computation Processors

A team of researchers at the University of Pittsburgh has developed a single-electron transistor called SketchSET, or sketch-based single-electron transistor to help build enhanced computer memories, electronic materials, and the quantum computer parts.

21 Apr 2011

STATS ChipPAC Dedicated to Development of Next Generation Wafer Level Integration with TSV Technology

STATS ChipPAC recently declared that it is extending its 300mm Through Silicon Via (TSV) portfolio with the addition of mid-end production capabilities.

21 Apr 2011

Nano and Miniature Connectors Available in 85 Positions

Omnetics Connector, a company that develops micro and nano sized miniature and high reliability connectors, has added to its Bi-Lobe family of nano miniature connectors up to 85 positions. The connectors are being offered in full QPL versions of MIL-DTL-32139 on .64mm centers.

21 Apr 2011