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Analysis on Trends in MEMS Manufacturing and Packaging

CEA-Leti, ASELTA to Develop E-Beam Proximity Effects Correction Solutions for Maskless Lithography

CEA-Leti, ASELTA to Develop E-Beam Proximity Effects Correction Solutions for Maskless Lithography

Stevens Scientists' Nanowire Research Article Appears in the Cover Page of Applied Physics Letters

Stevens Scientists' Nanowire Research Article Appears in the Cover Page of Applied Physics Letters

Global Market Report on Atomic Force Microscopes and AFM Probes

IMS CHIPS Adopts Cadence Silicon Realization Solutions for Mixed-Signal Gate Array Technology

IMS CHIPS Adopts Cadence Silicon Realization Solutions for Mixed-Signal Gate Array Technology

USHIO to Start Marketing New Nano-Imprint Vacuum Ultra Violet Ashing System

USHIO to Start Marketing New Nano-Imprint Vacuum Ultra Violet Ashing System

Nanometrics Supplies Next Generation 3D Metrology System for 3D Wafer Inspection

DCG Systems Secures IARPA Funding to Develop Logic Analysis and Fault Isolation Tools

DCG Systems Secures IARPA Funding to Develop Logic Analysis and Fault Isolation Tools

NEC Demonstrates Low Power Programmable Cell Array Using NanoBridge

NEC Demonstrates Low Power Programmable Cell Array Using NanoBridge

Synopsys Now Offers New DesignWare Data Converter IP for SMIC's 65 nm Process

Synopsys Now Offers New DesignWare Data Converter IP for SMIC's 65 nm Process

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