Today, Micron Technology, Inc. announced a new addition to its expansive portfolio of flash storage products, providing a purpose-built solution for cost-sensitive consumer applications seeking high performance and reliability.
Broadcom Corporation, a global innovation leader in semiconductor solutions for wired and wireless communications, today announced the industry's lowest-power Gigabit Ethernet (GbE) switch for home gateways, small business switch systems and wireless router applications.
Nantero, the world leader in carbon nanotube electronics, today announced it has closed a $31.5 million Series E financing round, which included new investors and participation from existing investors Charles River Ventures, Draper Fisher Jurvetson, Globespan Capital Partners, and Harris & Harris Group.
Synopsys, Inc. today announced STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has taped out their latest fully depleted silicon on insulator (FD-SOI) system on chip (SoC) using Synopsys' IC Compiler™ II place and route solution.
FUJIFILM Corporation (President: Shigehiro Nakajima) (hereafter, “Fujifilm”) and nano-electronics research institute, imec (CEO: Luc Van den hove), have demonstrated full-color organic light-emitting diodes (OLED) by using their jointly-developed photoresist technology for organic semiconductors, a technology that enables submicron patterning. This breakthrough result paves the way to producing high-resolution and large organic Electroluminescent(EL) displays and establishing cost-competitive manufacturing methods.
ANSYS, Inc. and TowerJazz, a leader in specialty foundry technology, are working to meet the growing demands for automotive, medical and Internet of Things (IoT) applications where product reliability and robustness are paramount. This collaboration has enabled TowerJazz to certify ANSYS® Totem™ and ANSYS® PathFinder™ software for its 180-nanometer (nm) process family design kits (PDKs) and reference design flow.
Xilinx, Inc. announced that it has collaborated with TSMC on the 7nm process and 3D IC technology for its next generation of All Programmable FPGAs, MPSoCs, and 3D ICs. The technology represents the fourth consecutive generation where the two companies have worked together on advanced process and CoWoS 3D stacking technology, and will become TSMC's fourth generation of FinFET technology. The collaboration will provide Xilinx a multi-node scaling advantage and build on its outstanding product, execution, and market success at 28nm, 20nm, and 16nm nodes.
Veeco Instruments Inc. announced today that Xiamen Changelight Co., Ltd. (Changelight) has purchased multiple TurboDisc® EPIK™ 700 Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) systems for faster production and greater yield of high-quality light emitting diodes (LED) for general lighting applications.
In fundamental research, materials science and industries such as semiconductor processing, life-sciences or manufacturing technology, piezo drives are used for the most challenging positioning tasks. The nano precise alignment of these devices – often multi-axis configurations – is a very crucial factor. Despite the progressing automation, it is sometimes still necessary to control positioning components manually. This is e.g. the case for particularly sensitive or complex set-ups, such as used in laboratory operation or for testing purposes.
The chemistry of the new electronics and electrics is key to its future, whether it is invisible, tightly rollable, biodegradable, edible, employing the memristor logic of the human brain or possessing any other previously- impossible capability in a manufactured device. De-risking that material development is vital yet the information on which to base that has been unavailable. No more.
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