Nanoelectronics News

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SEMATECH and Exogenesis Enter Alliance to Commercialize Accelerated Neutral Atom Beam Technology for Nanoelectronics Applications

SEMATECH and Exogenesis Corp. have agreed to a strategic alliance to commercialize Exogenesis' Accelerated Neutral Atom Beam (ANAB) technology and their nAcceltm accelerated particle beam equipment platform. "The chip industry is in the era of atomic scale processing. The applications of ANAB being developed will enable better controlled and more efficient manufacturing and open up new functionality for semiconductor devices," said Ron Goldblatt, Ph.D., SEMATECH CEO and President.

5 May 2015

Uniquify Announces Development of DDR3 IP Solution for Samsung's Power-Efficient 28nm LPP Foundry Process

Uniquify today announced it developed a DDR3 intellectual property (IP) solution for Samsung Electronics' power-efficient 28nm LPP foundry process that is now in volume production for multiple product lines, including consumer and mobile applications.

29 Apr 2015

SEM Measurements are Affected by Variations in Gate’s 3D Shape During Nanoscale Chip Fabrication

As microchip feature dimensions approach atomic scale, it becomes formidably difficult to measure their size and shape. According to the International Technology Roadmap for Semiconductors, within the next couple of years the typical length of a transistor’s “gate” – its on-off switch – will be less than 20 nanometers (nm, billionths of a meter).

29 Apr 2015

Aehr Test Systems Announces Initial Order for FOX-15 Multi-Wafer Test and Burn-In Systems

Aehr Test Systems, a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received an order from a new customer for a FOX-15 Multi-Wafer Test and Burn-In System, multiple WaferPak™ contactors and a WaferPak Aligner.

28 Apr 2015

Georgia Tech Institute for Electronics and Nanotechnology Supports MEMS-Related R&D

Your smartphone likely uses a dozen or so tiny — yet powerful — MEMS sensors to support its sophisticated functions. And that late-model car undoubtedly carries scores of devices based on MEMS and other sensing technologies.

25 Apr 2015

International Conference on Frontiers of Characterization and Metrology for Nanoelectronics 2015 Concludes Successfully

The characterization technology needed for nanoelectronic materials and device research, development, and manufacturing was discussed by experts from industry, government, and academia at the 2015 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics (FCMN), which was held in Dresden, Germany, on April 14-16, 2015.

24 Apr 2015

Synopsys Announces New Extensions to its Open-Source Interconnect Technology Format

Synopsys, Inc. today announced new extensions to its open-source Interconnect Technology Format (ITF) which enable modeling of complex device and interconnect parasitic effects at the advanced 10-nanometer (nm) process node. The new extensions include modeling of variation effects due to multi-patterning technology (MPT).

From Synopsys, Inc. 22 Apr 2015

University of Cambridge to Acquire Veeco’s Propel GaN MOCVD System for Power Electronics

Veeco Instruments Inc. announced today that the University of Cambridge, one of the most highly regarded research universities in the world, has ordered the Propel™ Power Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) System for GaN-on-silicon (Si) power electronics and light emitting diode (LED) research and development.

21 Apr 2015

Single Molecule Switches On Current Flow Using Light

Researchers from Konstanz and Dresden succeed in light-controlled molecule switching

21 Apr 2015

Kulicke & Soffa Joins A*STAR IME’s High-Density Fan-Out Wafer Level Packaging Consortium

Kulicke and Soffa Industries, Inc. today announced they are joining A*STAR’s Institute of Microelectronics (IME)’s High-Density Fan-Out Wafer Level Packaging (FOWLP) consortium, together with other major industry players.

20 Apr 2015

Nanoelectronics News

SEMATECH and Exogenesis Enter Alliance to Commercialize Accelerated Neutral Atom Beam Technology for Nanoelectronics Applications

Uniquify Announces Development of DDR3 IP Solution for Samsung's Power-Efficient 28nm LPP Foundry Process

SEM Measurements are Affected by Variations in Gate’s 3D Shape During Nanoscale Chip Fabrication

Aehr Test Systems Announces Initial Order for FOX-15 Multi-Wafer Test and Burn-In Systems

Georgia Tech Institute for Electronics and Nanotechnology Supports MEMS-Related R&D

International Conference on Frontiers of Characterization and Metrology for Nanoelectronics 2015 Concludes Successfully

Synopsys Announces New Extensions to its Open-Source Interconnect Technology Format

University of Cambridge to Acquire Veeco’s Propel GaN MOCVD System for Power Electronics

Single Molecule Switches On Current Flow Using Light

Kulicke & Soffa Joins A*STAR IME’s High-Density Fan-Out Wafer Level Packaging Consortium

Biochar-Modified Titanium Dioxide Nanocomposites for Enhanced Water Treatment

New Nanocage Material Removes Up to 90% of Toxic PFAS from Water

Enhancing Chitosan Films with Silanized Hexagonal Boron Nitride for Sustainable Applications

Gold Nanoparticles to Restore Vision in Retinal Disorders

Light-Induced Symmetry Shifts Enable New Advances in Nanomaterials

Overcoming Nanogold Production Challenges

Electrospinning and the Future of Nanotechnology

How Electrospinning is Shaping the Future of Nanotechnology

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