Nanoelectronics News

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Cadence Innovus Implementation System Supports Advanced 16/14/10nm FinFET

Cadence Design Systems, Inc. today unveiled Cadence® Innovus™ Implementation System, its next-generation physical implementation solution that enables system-on-chip (SoC) developers to deliver designs with best-in-class power, performance and area (PPA) while accelerating time to market.

From Cadence Design Systems 11 Mar 2015

Silicon Impulse, New Leti IC Design Platform, Offers One-Stop-Shop For Ultra-low-power Technologies

CEA-Leti announced the launch of its Silicon Impulse IC design competence center, a comprehensive IC technology platform offering IC design, advanced intellectual property, emulator and test services along with industria...

From CEA-Leti 10 Mar 2015

Toshiba Successfully Tapes Out Advanced 40nm SoC with Synopsys IC Compiler II

Synopsys, Inc. today announced that its IC Compiler™ II place and route solution has enabled Toshiba to accelerate tapeout of an advanced 40-nanometer (nm) system on chip (SoC). The impressive speed-up and superior QoR delivered by IC Compiler II enabled Toshiba to achieve higher designer productivity and better device performance.

From Synopsys, Inc. 10 Mar 2015

CMP, IRT Nanoelec Launch Platform for Multi-Project-Wafer, Post-Process 3D Integration

IRT Nanoelec, an R&D consortium focused on ICT using micro- and nanoelectronics, and CMP, which provides prototyping and low-volume production of ICs and MEMS, are launching a platform for multi-project-wafer, post-process 3D integration (3D-MPW).

6 Mar 2015

Xcell Journal Features Xilinx 16nm UltraScale+ Devices

Xilinx®, Inc. today announced immediate availability of the winter 2015 edition of its award-winning user magazine, Xcell Journal. The cover story for the 90th issue of Xcell Journal takes a system-level look at Xilinx's newly unveiled UltraScale+™ product portfolio of FPGAs, 3D ICs, and MPSoCs, and how the portfolio yields a 2-5X greater system level performance-per-watt advantage over 28nm devices.

5 Mar 2015

GUC Integrates Tri-Band AFE IP with WiGig for Integration of Digital Logic and Analog Monolithic Die in 28nm CMOS Process

Cadence Design Systems, Inc. today announced that Global Unichip Corporation (GUC) achieved first-silicon success integrating tri-band analog front-end (AFE) intellectual property (IP) with WiGig (IEEE 802.11ad), enabling integration of digital logic and analog monolithic die in an advanced 28nm complementary metal-oxide semiconductor (CMOS) process.

From Cadence Design Systems 5 Mar 2015

SUNY Poly CNSE and Israel’s Metro450 Consortium Partner to Develop Standard Calibration Wafers

Supporting Governor Andrew M. Cuomo's vision for New York State's continued leadership in the global high-tech economy, SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE) and Israel’s Metro450 consortium today jointly announced plans to develop and produce Standard Calibration Wafers (SCW) for use with 300mm and 450mm metrology and process tools. The initiative will generate $2.9 million in investment and support more than 100 jobs in New York and Israel.

4 Mar 2015

Toshiba Develops STT-MRAM Circuit for High-Performance Processors and SoC Integrated Circuits

We have developed a spin-transfer torque magnetoresistive random-access memory (STT-MRAM) circuit for use in high-performance processors and system-on-a-chip (SoC) integrated circuits, implementing a 1-Mb class of new magnetic materials. The newly developed memory circuit allows low-power, high-efficiency, high-speed performance in energy-efficient magnetic tunnel junction (MTJ) memory.

3 Mar 2015

New Hybrid, Transparent Materials Made of Silver Nanowires and Conductive Polymers

Cambrios Technologies Corporation, the leader in silver nanowire-based solutions for the transparent conductor markets and Heraeus, the leader in conductive polymer technology, today announced a new class of hybrid, transparent, conductive materials made of silver nanowires and conductive polymers.

3 Mar 2015

SanDisk Introduces iNAND 7132 Solution with 1Y Nanometer 3-Bit-Per-Cell (X3) NAND Flash Storage

MOBILE WORLD CONGRESS 2015 – SanDisk Corporation, a global leader in flash storage solutions, today introduced the iNAND®7132 storage solution, the most advanced embedded storage solution from SanDisk to date.

2 Mar 2015

Nanoelectronics News

Cadence Innovus Implementation System Supports Advanced 16/14/10nm FinFET

Silicon Impulse, New Leti IC Design Platform, Offers One-Stop-Shop For Ultra-low-power Technologies

Toshiba Successfully Tapes Out Advanced 40nm SoC with Synopsys IC Compiler II

CMP, IRT Nanoelec Launch Platform for Multi-Project-Wafer, Post-Process 3D Integration

Xcell Journal Features Xilinx 16nm UltraScale+ Devices

GUC Integrates Tri-Band AFE IP with WiGig for Integration of Digital Logic and Analog Monolithic Die in 28nm CMOS Process

SUNY Poly CNSE and Israel’s Metro450 Consortium Partner to Develop Standard Calibration Wafers

Toshiba Develops STT-MRAM Circuit for High-Performance Processors and SoC Integrated Circuits

New Hybrid, Transparent Materials Made of Silver Nanowires and Conductive Polymers

SanDisk Introduces iNAND 7132 Solution with 1Y Nanometer 3-Bit-Per-Cell (X3) NAND Flash Storage

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Combining Nanofluids and Turbulators for Sustainable Energy

Multiscale Force Sensing with Photon-Avalanching Nanocrystals

Novel Method for Producing Superior Carbon Nanofibers via Additive Nanostructuring

Optimizing Methylene Blue Removal with Bovine Serum Albumin Nanoparticles

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

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Characterization of Active Pharmaceutical Ingredients, Injectables, and Proteins

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The Evolution of Lipid Nanoparticles

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