In making a solar cell, scientists etch nanoscale spikes into a silicon wafer in order to maximize its surface area and consequently to maximize the amount of sunlight to reach it. Metal particles have been used as a catalyst in this process because etching is much accelerated near metal particles.
Aehr Test Systems, a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received a follow-on order for its Advanced Burn-in and Test System (ABTS) from a leading manufacturer of advanced logic integrated circuits (ICs) for automotive, embedded processing, digital signal processing and analog applications.
According to new market report "Internet of Nano Things Market by Communication Type (Short & Long Distance Communication), by Nano Components & Devices (Cameras, Phones, Scalar Sensors, Processors, Memory Cards, Power Systems, Antennas & Transceivers) - Worldwide Forecast & Analysis (2016 - 2020), by MarketsandMarkets, defines and segments the IoNT Market into various sub-segments with in-depth analysis and forecasting of revenues. It also identifies drivers and restraints of this market with insights on trends, opportunities, and challenges.
TowerJazz, the global specialty foundry leader, and TowerJazz Panasonic Semiconductor Co., Ltd. (TPSCo) today announced its first major third party CMOS image sensor (CIS) customer, Himax Imaging, Inc., a subsidiary of Himax Technologies, Inc., that is developing its next generation high end cameras for smart phone applications using TPSCo’s state of the art 1.12um-pixel CMOS image sensor (CIS) 65nm process.
Altera Corporation today announced military temperature (Mil Temp) qualification plans for its newest 20 nm Arria® 10 FPGAs and SoCs, which will be qualified for extreme temperature environments (-55C to 125C ambient). In addition to the ratings, Altera can provide guidelines on speed grades, protocols, and external memory interfaces best suited to specific applications.
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced the new RH850/C1x Series of 32-bit microcontrollers (MCUs), designed for motor control in hybrid electric vehicles (HEVs) and electric vehicles (EVs).
In the consumer electronics industry, the mantra for innovation is higher device performance/less power. Arun Thathachary, a Ph.D. student in Penn State’s Electrical Engineering Department, spends his days and sometimes nights in the cleanroom of the Materials Research Institute’s Nanofabrication Laboratory trying to make innovative transistor devices out of materials other than the standard semiconductor silicon that will allow higher performance using less power.
Scientists have developed what they believe is the thinnest-possible semiconductor, a new class of nanoscale materials made in sheets only three atoms thick.
By combining plasmonics and optical microresonators, researchers at the University of Illinois at Urbana-Champaign have created a new optical amplifier (or laser) design, paving the way for power-on-a-chip applications.
Today, KLA–Tencor Corporation introduced the WaferSight™ PWG patterned wafer geometry measurement system, the LMS IPRO6 reticle pattern placement metrology system and the K–T Analyzer® 9.0 advanced data analysis system.
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