Sep 8 2010
Ultrasonic Systems, Inc. (USI), a leading manufacturer of high-performance ultrasonic spray coating equipment, announces the release of the third generation of its PV360 for PV wafer coating applications.
The PV360 leverages USI’s proprietary, nozzle-less ultrasonic technology for highly uniform, thinner coating deposition when compared to conventional spray technologies. Optimized for high-volume, in-line manufacturing, the PV360 can process up to 4,300 wafers (125mm) per hour. The third generation of the PV360 features a wafer dryer system, dual metering pump liquid delivery system, and state-of-the-art control system with touch-panel interface. The PV360 increases manufacturing quality, efficiency, throughput, and reliability for the in-line thermal diffusion and laser doped selective emitter (LDSE) processes.
PV360 coating system
The PV360 delivers liquid coating with transfer efficiency of 95-99%, utilizing a traversing Ultra-Spray® blade head for greater control of film thickness, down to the sub-micron level. Plus, it offers the versatility to handle the transfer of phosphoric/boric acid and phosphoric oxide dopants, as well as other proprietary coatings.
“We are pleased to be able to incorporate customer specific features to our PV360 coating system” said Stuart Erickson, President of Ultrasonic Systems, “These latest innovations reflects our commitment to offering coating solutions that meet the specific application requirements of our customers.”
The PV360 utilizes a self-cleaning Teflon© coated Kevlar® mesh belt to transport the silicon wafers under the traversing Ultra-Spray ultrasonic blade head. The system can be operated in-line or as a stand-alone process. USI coating systems are industry proven with more than 2,500 systems installed worldwide across multiple markets.
Source: http://www.ultraspray.com/