Xradia has released the VersaXRM-500, the latest generation of three-dimensional X-ray microscopy (XRM) solutions optimized for non-destructive micro tomography.
It offers larger working distance, high resolution and sample adaptability. The new system can be used in several research applications related to semiconductor, materials science, geomaterials and life sciences.
Nanotechnology Research Applications" />VersaXRM-500
Rod Browning, CEO of Xradia, has stated that previously scientists had to select either non-devastating imaging at low resolution or devastative imaging at superior resolution. He mentioned that their VersaXRM-500 has enabled researchers to overcome these restraints and the device has exceeded the capabilities of the conventional microCT. He added that the VersaXRM offers greater insight, quicker outcomes and improved confidence in research activities.
The VersaXRM series was developed on true submicron spatial resolution, which is a good marker of imaging precision. It also offers greater resolution at extended working distances ideal for in situ research utilizing ecological chambers or load cells and under changing ecological situations.
The device also includes improved adaptability for correlative microscopy with multi-length scale imaging utilizing the VersaXRM in combination with the UltraXRM or other microscopy methods. Imaging adaptability in conjunction with extended working distances enhances the microCT value and volume enhancements provide significant advancements in semiconductor and oil and gas segments.
Mario Pacheco, Staff R&D Engineer at Intel, has stated that the latest trends in package assembly have offered several challenges for flaw removal and characterization. He added that Xradia's innovations have offered quicker and non-devastative method offering superior resolution categorization of integral packages.
The non-destructive submicron resolution tomographic ability of the system enables the identification of hidden aspects without the requirement of cutting, de-packing or destructing the device. This feature also avoids the loss of crucial data on the basic reason behind the breakdown due to devastative imaging techniques.
The VersaXRM-500 offers superior resolution imaging across an entire range of huge sample sizes measuring 50 mm. According to Philip J. Withers, Professor of Materials Science at the University of Manchester's Henry Moseley X-ray Imaging Facility, it is essential to determine the microstructure of a fissure and any related destruction buildup in three-dimensions at superior resolution. He added that the non-damaging sub-micron imaging effectively traces events of the damage.
The device supports stained and unstained hard and soft tissue studies. It enables virtual core analysis approach, resulting in quicker outcomes, enhanced quantification of comprehensive structures and linking of pores across several magnifications and sample quantities. The VersaXRM series and the UltraXRM serve as the latest three -dimensional X-ray microscopes based on sophisticated X-ray optic and detector technology.
Source: http://www.xradia.com