ANTARES Cryokinetic System Can Process 200 to 300mm Wafers

FSI International, a Minneapolis-based developer of equipment that condition surfaces for applications in microelectronics, recently received orders to deliver multiple ANTARES Cryokinetic cleaning platforms.

The client has already been using the ANTARES platform in multiple processes to remove BEOL particles, such as following in-line wafer testing and defectivity procedures in order to enhance overall device output. Its all-dry defect removal technique ensures that the Cryokinetic technology can be used in these applications. The systems will be delivered in the third quarter of 2011.

The system is an automated, single-wafer, Cryokinetic device that can process 200 to 300mm wafers that will be able to remove nano-particles. The technology is a completely dry, non-reactive procedure that takes away particles when they come in contact with high-speed cryogenic Ar/N2 aerosol. This lowers contaminants while allowing the wafer surfaces to remain undamaged, including on films fabricated from copper and porous low-k. The efficient dry cleaning method can be applied in multiple particle removal processes in FEOL and BEOL.