The Institute of Microelectronics (IME) has joined hands with TowerJazz, which is a specialty foundry leader on projects in packaging, micro-electro-mechanical systems (MEMS) and application-specific integrated circuits (ASICs).
IME’s aim is to accelerate the R&D in microelectronics in the field of MEMS, IC design and packaging. IME chooses to work with either fab-lite or fabless device companies as R&D partners along with TowerJazz who would work as a manufacturing partner in a three party alliance framework. This team effort has given results in the areas of pressure sensors, inertial sensors and micromirrors with MEMS product firms. There are also possibilities of future collaborations in areas of through-silicon via TSV and photonics, 3D integrated chips, nanoelectronics and advanced packaging.
MEMS devices have a huge market almost US$8billion and are expected to grow further. These devices are being used in a diverse range of applications, such as devices in medical and industrial sectors, and in consumer electronics. According to Prof. Dim-Lee Kwong, who is the Executive Director of IME, using TowerJazz’s extensive technology portfolio and manufacturing superiority in specialty products has been of great benefit to IME as they have been able to maintain a competitive position and sustain a development edge in their fields. Furthermore, utilizing the high volume of Complementary Metal Oxide Semiconductor (CMOS) manufacturing processes would in turn help to reduce the MEMS cost and also enhances integration along with other CMOS based technological devices.