SPTS Acquires XeF2-Based Release Etch Technology Provider, XACTIX

SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced that it has acquired XACTIX, Inc., the market leading provider of xenon difluoride (XeF₂)-based release etch technology. XACTIX is located in Pittsburgh, Pennsylvania.

Manufacturing micro-electromechanical systems (MEMS) devices such as microphones, inertial sensors and RF switches, often requires a “release etch” step to remove a sacrificial layer to allow free movement of specific parts of the mechanical structure. By adding the XACTIX product line to its HF vapor phase release offering, SPTS now supports release technologies for silicon/molybdenum/germanium and silicon oxide sacrificial layers. Both processes offer advantages over traditional wet etch solutions because they eliminate “stiction” between moving parts, which can make precision MEMS devices inoperable.

SPTS and XACTIX jointly developed the CVE single wafer XeF₂ release etch module and have shared sales/marketing channels over a number of years.

“Bringing XACTIX’s technology and product portfolio into the SPTS family is a natural and logical step for us.” said William Johnson, president and CEO at SPTS. “This expands our product offering in MEMS release etch and adds to our MEMS toolbox.”

Kyle Lebouitz, CTO & Founder of XACTIX echoed these sentiments, “This evolution of the long-standing relationship between SPTS and XACTIX will expand our opportunities in the MEMS market, and provide our customers with an enlarged and comprehensive sales and support infrastructure.”

XACTIX operations and personnel will now become part of SPTS’ Release Etch Division, also based in Pennsylvania.