PIE Scientific has extended its successful Tergeo range of RF plasma cleaners with the introduction of Tergeo-Pro - a large chamber yet compact bench top RF plasma system designed for plasma etching, ashing, cleaning and surface modification applications.
© Labtech Electron Microscopy
A large 230mm (9”) diameter, 430mm (13.4”) deep process chamber accommodates 8″ wafers or two 25/50 slot 6″ or 4″ quartz wafer boats.
Tergeo-Pro has a 150W RF power supply with upgrade options to 300W and 500W power, adjustable in 1W increments. Tergeo-Pro uses a radio frequency (RF) of 13.56MHz, which offers much higher plasma generation efficiency than KHz RF plasma systems. RF power is continuous, with the option to upgrade to pulsed mode, which allows the power to be pulsed from an average of power of 100% to less than 1%.
Tergeo-Plus’s quartz process chamber wall enables an external capacitively coupled RF electrode design, which generates a more uniform plasma across the whole chamber, compared to systems with chamber mounted electrodes.
A key advantage of the Tergeo-Pro is the integrated, patent-pending RF plasma sensor technology. Plasma strength is measured quantitatively and displayed in real time. The new and experienced operators can use the plasma strength data as feedback to adjust gas flow rates and RF power to give desired cleaning speeds – ensuring repeatable and consistent results for a wide range of samples.