SUSS MicroTec Partner to Demonstrate Integrated Process Solutions for 3D Wafer Level Packaging

NEXX Systems, Surface Technology Systems (STS), and SUSS MicroTec today announced they will collaborate with Fraunhofer IZM to demonstrate integrated process solutions for 3D wafer level packaging. As a first action, a series of seminars has been scheduled from October 26 to November 7, 2007. The seminars will be held in Singapore, Japan, China, Korea, and Taiwan and are targeted at packaging industry professionals involved in 3D packaging applications.

The seminars will cover optimization of integrated process solutions from the point of view of performance and cost. Leading edge total process solutions for 3D wafer level packaging will be demonstrated by combining the expertise of STS in deep reactive ion etch (DRIE) for via fabrication, NEXX Systems in PVD and Electrodeposition for lining and filling of vias, and SUSS MicroTec in wafer bonding and photolithography. Fraunhofer IZM will complement these strengths with their extensive expertise in 3D wafer level packaging, acting as both a consultant and active participant in the integration of process solutions.