Jan 8 2008
Veeco Instruments Inc., announced the introduction of its new InSight(TM) 3D Automated Atomic Force Microscope (AFM) Platform, the only metrology system available with the accuracy and precision required for non-destructive, high resolution three-dimensional (3D) measurements of critical 45nm and 32nm semiconductor features, with the speed to qualify as a true fab tool. Veeco's InSight 3DAFM was designed specifically to address Critical Dimension (CD), depth and chemical mechanical planarization (CMP) metrology in a production environment.
The InSight 3DAFM from Veeco.
John R. Peeler, Chief Executive Officer of Veeco, commented, "With three times the throughput (30 wafers per hour) and two times the measurement accuracy and precision of our previous AFMs, Veeco's InSight represents an entirely new approach for semiconductor 3D metrology. It is the only tool on the market today providing in-line, accurate, non-destructive 3D information, to drive shorter process development and manufacturing ramp times, improve our customers' cost of ownership and decrease their manufacturing risk."
"At 45nm and below, current in-line metrology techniques are limited in their ability to measure CD," added Paul Clayton, Vice President, Veeco's Auto AFM Business Unit. "Technologies such as CD-SEM and scatterometry are precise, but not accurate enough, causing significant measurement issues. Veeco's InSight provides the lowest measurement uncertainty for CD metrology, which leads to improved process control."