Jul 16 2008
Neah Power Systems, Inc., a leading developer of fuel cells for military, industrial and consumer portable electronic devices, announced today that it has an ongoing strategic relationship with Aspen Technologies to utilize their high-reliability semiconductor packaging expertise in commercializing its silicon based fuel cell systems. Aspen Technologies is a world-class advanced-packaging service provider enabling its customers to rapidly bring new products to market through the creative application of advanced microelectronic package and assembly technologies, innovative engineering, and scalable manufacturing solutions.
Jack Harrison, CEO of Aspen Technologies said, “We are pleased that Neah Power has engaged us for our packaging expertise and manufacturing capabilities. We are accustomed to developing and manufacturing extremely complex devices with tight intellectual property security requirements. Our assembly services include quick-turn engineering prototypes to fully manufactured devices under SPC control. We look forward to a mutually beneficial relationship with Neah Power Systems and our participation in commercializing its proprietary fuel cell technology.”
Dr. Chris D’Couto, President and CEO of Neah Power said, “We have been working with Aspen Technologies to develop high reliability and longer lifetime packaging for our electrochemical cells. We are impressed with Aspen Technologies capabilities, in-house expertise, and their commitment to their customers. We are pleased to have Aspen Technologies contribute to our initial low-volume production run. Aspen Technologies expertise extends beyond just solving unique semiconductor packaging problems, but also includes fabrication sourcing and high volume manufacturing. Our differentiated product enables this multi-sourced manufacturing model; this is another example of how we are leveraging outside world-class expertise to facilitate the commercialization of our product.”