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  • News - 2 Apr 2007
    Crumpled kitchen foil that lays flat for reuse. Bent bumpers that straighten overnight. Dents in car doors that disappear when heated with a hairdryer. These and other physical feats may become...
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    Nanosurf: Zoom into the future Nanosurf is a company that thrives on challenges at the frontier of what is physically achievable. By concentrating our collective efforts on the obstacles that stand...
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    The Microscopy business group at Carl Zeiss is the world's only manufacturer of light, X-ray, electron, and ion microscopes. The company's extensive portfolio enables industrial, research and...
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    Elkington and Fife LLP is a leading firm of patent and trade mark attorneys dealing with all areas of technology.  The firm has offices in Central London and Sevenoaks, Kent. Elkington and Fife...
  • Supplier Profile
    NVE develops and sells devices using "spintronics," a nanotechnology we helped pioneer, which utilizes electron spin rather than electron charge to acquire, store and transmit...
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    PI is a privately held company that designs and manufactures world-class precision motion and automation systems including air bearings, hexapods, and piezo drives at locations in North America,...
  • News - 18 Feb 2010
    Open-Silicon, Inc., a leading ASIC design and semiconductor manufacturing company, and Virage Logic (Nasdaq: VIRL), the semiconductor industry's trusted IP partner, today announced a partnership...
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    WITec GmbH pioneered 3D Raman imaging and correlative microscopy and continues to lead the industry with a product portfolio that offers speed, sensitivity and resolution without compromise. Raman,...
  • News - 9 Apr 2015
    Synopsys, Inc. today announced the availability of a broad portfolio of DesignWare® PHY IP for TSMC's 16-nanometer (nm) FinFET Plus (16FF+) processes, enabling designers to integrate required...
  • News - 4 Aug 2009
    BeSang Inc., a leader in the design, development, and delivery of unsurpassed 3-dimensional integrated circuit solutions, has successfully developed a multi-layer stacked three-dimensional (3D)...

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