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LPD Process Helps Achieve Thinner Texturized Silicon Wafers

Natcore Technology researchers have revealed that the company’s liquid phase deposition (LPD) method could help in the application of an antireflective (AR) coating to planar and textured solar cells resulting in a decrease of wafer thickness by doing away with the thermal vacuum AR coating procedure.

19 May 2011

IXYS and GMCH Ink Contract for Semiconductor Wafer Chip Manufacture

IXYS and General Motors Components Holdings (GMCH) have signed an agreement to manufacture power semiconductor wafers. In an endeavor to develop and own technologies, IXYS created its in-house facility.

19 May 2011

Fluidigm’s Singapore Facility Dispatches over One Billion Microscopic NanoFlex Valves

Fluidigm has declared that its facility in Singapore has fabricated and dispatched microscopic NanoFlex valves to the count of over a billion.

From Standard BioTools 19 May 2011

Nanocrystal Coating on Solar Cells Help Enhance Efficiency and Reduce Costs

SolarPA has deployed its own nanocrystal coating on solar cells in a collaborative program with Solar Power Industries to enhance the efficiency of solar cells by 11.5%. According to Dr. Robert Castellano, chief execu...

17 May 2011

Accurate Three-Dimensional Post-Layout Extraction Suitable for Nano-energy Devices and Image Sensing Applications

Electronic Design Automation (EDA) company, Silicon Frontline Technology in its verification of post-layout solutions focused on nanometer design applications, and will participate in events through May and June

17 May 2011

Intel’s 22nm microprocessor to Incorporate Tri-Gate Transistor Design

According to Paul Otellini, president and chief executive officer at Intel, the three-dimensional Tri-Gate transistor design has been incorporated by his company using Moore’s Law for volume production, and will enable development of advanced technologies and solutions.

17 May 2011

Synopsys, Shanghai Hua Hong NEC Electronics Declare the Availability of version 3- 130nm reference flow

Synopsys, a global provider of software and IP for design, verification and production of semiconductors, and Shanghai Hua Hong NEC Electronics, a Mainland China developer of IC foundry service, recently declared that the 130nm reference flow, version 3.0 is available.

From Synopsys, Inc. 17 May 2011