Ultratech, Inc., a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today announced that it has moved Ultratech/Cambridge NanoTech to Waltham, Mass.
Broken bones and joint replacements may someday heal faster, thanks to an unusual coating for medical implants under development at The Ohio State University.
When University of Pennsylvania nanoscientists created beautiful, tiled patterns with flat nanocrystals, they were left with a mystery: why did some sets of crystals arrange themselves in an alternating, herringbone style, even though it wasn’t the simplest pattern? To find out, they turned to experts in computer simulation at the University of Michigan and the Massachusetts Institute of Technology.
The new Helios series of sub-nanosecond solid-state lasers from Coherent, Inc. deliver superior results in dicing, scribing and marking applications. With a pulse repetition frequency of 50 kHz and a pulsewidth of <600 ps, Helios’ unique combination of high average power and high peak power enables faster throughput in industries such as electronics and photovoltaics (solar).
An international collaboration including researchers from the NIST Center for Nanoscale Science and Technology and the Universidad San Francisco de Quito, Ecuador have fabricated a self-assembled nanofiber from a DNA building block that contains both duplex (two-stranded) and quadruplex (four-stranded) DNA.
Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced that PixArt Imaging Inc., a leading advanced digital imaging IC design company, has selected the company’s Analog FastSPICE (AFS) Platform for block-level characterization, full-circuit verification, and device noise analysis of their image sensor designs.
Toronto-based Integran Technologies Inc. (Integran) today announced US 8,486,319 issued July 16, 2013 describing new applications for its nanoplating technology (Nanovate™ NP) for imprinting polymer surfaces to render them super-hydrophobic and/or self-cleaning.
United Microelectronics Corporationand SuVolta, Inc., today announced joint technology development of a 28nm process that integrates SuVolta’s Deeply Depleted Channel™ (DDC) transistor technology into UMC's 28nm High-K Metal Gate (HKMG) high-performance mobile (HPM) process.
Ultratech, Inc., a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today announced that its laser spike annealing (LSA) technology has been selected as a primary 450-mm millisecond annealing tool for the Global 450-mm Consortium (G450C), headquartered at SUNY's College of Nanoscale Science and Engineering (CNSE) in Albany, NY.
MagnaChip Semiconductor Corporation ("MagnaChip"), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, and the National Nano Fab Center ("NNFC") have entered into an SOI RF CMOS technology transfer agreement which combines MagnaChip's specialty manufacturing expertise with NNFC's robust RF technology.
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