Nanofabrication News

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Applied Materials Introduces NMOS Transistor Application for Applied Centura RP Epi System

Applied Materials, Inc. is extending its decade-long leadership in epitaxial (epi) technology with a newly developed NMOS transistor application for its Applied Centura® RP Epi system.

9 Jul 2013

Dow Corning Joins imec Nanoelectronics Research Center to Work on 3D Semiconductor PAckaging Technology

Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced today that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics. The announcement signals expanded opportunities for both organizations to combine their expertise toward the development and broader adoption of 3D integrated circuit (IC) packaging technologies, wherein IC chips are stacked in vertical 3D architectures.

From IMEC 8 Jul 2013

USHIO to Deliver Interposer Stepper for 2.5D/3D Packaging Applications to Leading Manufacturer

USHIO INC. today announced that the company has booked the large-field stepper “UX7-3Di LIS 350” for manufacturing interposers used for 2.5D/3D packaging applications, and will deliver the first unit to a leading advanced-packaging manufacturer by the end of this month.

8 Jul 2013

OSU Researchers Use Ethylene Glycol for Making Thin-Film Solar Cells

A process combining some comparatively cheap materials and the same antifreeze that keeps an automobile radiator from freezing in cold weather may be the key to making solar cells that cost less and avoid toxic compounds, while further expanding the use of solar energy.

4 Jul 2013

ASU Researchers Fabricate Nanotweezers for Accurate Control of Enzymes

Tweezers are a handy instrument when it comes to removing a splinter or plucking an eyebrow.

4 Jul 2013

New Dynamic Online Tool for Selecting, Comparing and Quoting RF Probes

Cascade Microtech, Inc., a leader at enabling precision measurements of integrated circuits at the wafer level, today announced the launch of a new dynamic online tool for selecting, comparing and quoting probes from a wide variety of RF frequencies and pitches for different applications and device types.

From FormFactor 3 Jul 2013

Novati Announces Launch of Nanofabrication Services and Manufacturing Site

Novati Technologies announced today the launch of its nanofabrication services and manufacturing site, featuring the world’s broadest portfolio of product-development capabilities and materials. The newly named company builds on 25 years of technology leadership cultivated from its roots at SEMATECH and, most recently, the SVTC fabrication foundry.

2 Jul 2013

EV Group Introduces High-Volume Room-Temperature Wafer Debonding Platform

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced its LowTemp™ debonding platform, which features three different room-temperature wafer-debonding processes and an extended material supply chain.

From EV Group 2 Jul 2013

Scifiniti Introduces Ultra-Low Cost, Drop-In Replacement PV Silicon Wafer

Scifiniti came out of stealth mode today, with the announcement of its first product, SmartWafer™. SmartWafer is an ultra-low cost, drop-in replacement photovoltaic (PV) silicon wafer that offers the same form factor and performance as traditional wafers, but costs less than half as much to produce.

2 Jul 2013

STATS ChipPAC Granted its 1,000th Patent by USPTO

STATS ChipPAC Ltd. (“STATS ChipPAC” or the “Company”), a leading provider of advanced semiconductor packaging and test services, today announced that it has been granted its 1,000th patent by the U.S. Patent and Trademark Office (USPTO).

2 Jul 2013