Nanofabrication News

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CEA-Leti Programs Extend 193nm Immersion Lithography for 1X Nodes

CEA-Leti said today that its multi-partner programs, IDEAL and IMAGINE, have demonstrated cost-effective solutions that extend 193nm immersion lithography for 1X nodes for critical levels such as contact and via, and for the cut layer, when multi-patterning is used.

From CEA-Leti 10 Jul 2013

EV Group Unveils Fusion Wafer Bonding Platform for Manufacturing 3D-Integrated CMOS Image Sensors

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the latest version of its EVG®40NT automated measurement system, which is designed to work in concert with the company's GEMINI® FB fusion wafer bonding system to support the manufacture of next-generation 3D-integrated CMOS image sensors.

9 Jul 2013

Michigan Technological University Researchers Build Nano Battery with AC-STEM Microscope Using Tin Oxide

Lithium ion batteries are at the energetic heart of almost all things tech, from cell phones to tablets to electric vehicles. That’s because they are a proven technology, light, long-lasting and powerful. But they aren’t perfect.

9 Jul 2013

Rice University Researchers Create New Kind of Carbon Fibers Using Graphene Oxide

Large flakes of graphene oxide are the essential ingredient in a new recipe for robust carbon fiber created at Rice University.

9 Jul 2013

Applied Materials Introduces NMOS Transistor Application for Applied Centura RP Epi System

Applied Materials, Inc. is extending its decade-long leadership in epitaxial (epi) technology with a newly developed NMOS transistor application for its Applied Centura® RP Epi system.

9 Jul 2013

Dow Corning Joins imec Nanoelectronics Research Center to Work on 3D Semiconductor PAckaging Technology

Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced today that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics. The announcement signals expanded opportunities for both organizations to combine their expertise toward the development and broader adoption of 3D integrated circuit (IC) packaging technologies, wherein IC chips are stacked in vertical 3D architectures.

From IMEC 8 Jul 2013

USHIO to Deliver Interposer Stepper for 2.5D/3D Packaging Applications to Leading Manufacturer

USHIO INC. today announced that the company has booked the large-field stepper “UX7-3Di LIS 350” for manufacturing interposers used for 2.5D/3D packaging applications, and will deliver the first unit to a leading advanced-packaging manufacturer by the end of this month.

8 Jul 2013

OSU Researchers Use Ethylene Glycol for Making Thin-Film Solar Cells

A process combining some comparatively cheap materials and the same antifreeze that keeps an automobile radiator from freezing in cold weather may be the key to making solar cells that cost less and avoid toxic compounds, while further expanding the use of solar energy.

4 Jul 2013

ASU Researchers Fabricate Nanotweezers for Accurate Control of Enzymes

Tweezers are a handy instrument when it comes to removing a splinter or plucking an eyebrow.

4 Jul 2013

New Dynamic Online Tool for Selecting, Comparing and Quoting RF Probes

Cascade Microtech, Inc., a leader at enabling precision measurements of integrated circuits at the wafer level, today announced the launch of a new dynamic online tool for selecting, comparing and quoting probes from a wide variety of RF frequencies and pitches for different applications and device types.

From FormFactor 3 Jul 2013

Nanofabrication News

CEA-Leti Programs Extend 193nm Immersion Lithography for 1X Nodes

EV Group Unveils Fusion Wafer Bonding Platform for Manufacturing 3D-Integrated CMOS Image Sensors

Michigan Technological University Researchers Build Nano Battery with AC-STEM Microscope Using Tin Oxide

Rice University Researchers Create New Kind of Carbon Fibers Using Graphene Oxide

Applied Materials Introduces NMOS Transistor Application for Applied Centura RP Epi System

Dow Corning Joins imec Nanoelectronics Research Center to Work on 3D Semiconductor PAckaging Technology

USHIO to Deliver Interposer Stepper for 2.5D/3D Packaging Applications to Leading Manufacturer

OSU Researchers Use Ethylene Glycol for Making Thin-Film Solar Cells

ASU Researchers Fabricate Nanotweezers for Accurate Control of Enzymes

New Dynamic Online Tool for Selecting, Comparing and Quoting RF Probes

Biochar-Modified Titanium Dioxide Nanocomposites for Enhanced Water Treatment

Gold Nanoparticles to Restore Vision in Retinal Disorders

New Nanocage Material Removes Up to 90% of Toxic PFAS from Water

Enhancing Chitosan Films with Silanized Hexagonal Boron Nitride for Sustainable Applications

Light-Induced Symmetry Shifts Enable New Advances in Nanomaterials

Overcoming Nanogold Production Challenges

Electrospinning and the Future of Nanotechnology

How Electrospinning is Shaping the Future of Nanotechnology

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