Nanofabrication News

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ProPlus Design Solutions’ SPICE Simulator Selected by eSilicon for 28/16nm IP Designs

ProPlus Design Solutions, Inc. today announced that eSilicon Corporation, a leading independent semiconductor design and manufacturing solutions provider, has selected its high-performance parallel SPICE simulator and its variation analysis platform for advanced intellectual property (IP) designs at 28-nanometer (nm), 16nm and beyond.

22 Jul 2015

Xilinx Offers Vivado Design Suite Early Access Support for 16nm UltraScale+ Portfolio

Xilinx, Inc. today announced Vivado® Design Suite early access support for the 16nm UltraScale+™ portfolio, including Zynq® UltraScale+ and Kintex® UltraScale+ devices. The Vivado early access release has been co-optimized with the UltraScale+ ASIC-class programmable logic to exploit the full advantages of production UltraScale+ devices, leveraging the complete catalog of SmartCORE™ and LogiCORE™ IP.

22 Jul 2015

II-VI Advanced Materials Exhibits World's First 200mm SiC Substrates at 2015 CS MANTECH Conference

II]VI Incorporated ] II]VI Advanced Materials, a world leading supplier of single crystal SiC (silicon carbide) substrates and CVD]grown polycrystalline diamond materials, recently exhibited the worldfs first 200mm diameter SiC wafer at the 2015 Compound Semiconductor Manufacturing Technology (CS MANTECH) conference in Scottsdale, AZ and the International SiC Power Electronics Applications Workshop (ISiCPEAW) in Stockholm, Sweden.

20 Jul 2015

Oxford Instruments and Lancaster University to Develop Ultra Low Temperature Systems for Quantum Sensors with UK Funding

Quantum technologies are poised to revolutionise our daily lives in the future, just as the semiconductor revolution did starting some fifty years ago. The UK Government has identified quantum technologies as a strategic area for investment, launching the £270 million ‘UK National Quantum Technologies Programme’ in its 2013 autumn statement.

From Oxford Instruments Nanoscience 17 Jul 2015

Entegris Releases Torrento X Series 7nm Filters with FlowPlane Linear Filtration Technology

Entegris, Inc., a leader in yield-enhancing materials and solutions announced today the release of Torrento® X Series 7 nm filters with FlowPlane™ linear filtration technology. FlowPlane is the semiconductor industry's first scalable, linear, high-flow filtration platform enabling advanced wet cleaning applications for the 10 nm node and beyond. The first in a series of filters based on the linear filtration technology, the FlowPlane S model is designed for point of dispense (POD) applications, enabling improvements in both on-wafer defectivity and yield for critical wet cleaning applications.

15 Jul 2015

imec Demonstrates Pore-Sealing Low-K Dielectrics in Advanced Interconnects at SEMICON West

Nano-electronics research center imec announced today at SEMICON West that it has demonstrated concept and feasibilityfor pore-sealing low-k dielectrics in advanced interconnects. The method, based on the self-assembly of an organic monolayer, paves the way to scaling interconnects beyond N5.

From IMEC 15 Jul 2015

SEMICON WEST 2015: imec and Besi Develop Automated Thermocompression Solution for Narrow-Pitch Die-to-Wafer Bonding

Today, at SEMICON WEST 2015 (San Francisco), world-leading nano-electronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries announced that they have jointly developed an automated thermocompression solution for narrow-pitch die-to-wafer bonding, a method by which singulated dies are stacked onto bottom dies which are still part of a fully intact 300mm wafer. The solution features high accuracy and high throughput, paving the way to a manufacturable 2.5D, 3D, and 2.5D/3D hybrid technology.

From IMEC 15 Jul 2015

CEA-Leti Announces Feasibility of CoolCube in FinFET Technology on 300mm Production Line

CEA-Leti today announced its first results towards the demonstration of CoolCube’s feasibility in FinFET technology on its 300mm production line, and new CoolCubeTM circuit designs that improve the trade off between area, speed and power.

From CEA-Leti 14 Jul 2015

Applied Materials Introduces Centris Sym3 Etch System with New Chamber for Atomic-Level Precision Manufacturing

Applied Materials, Inc. today announced a next-generation etch tool, the Applied Centris(TM) Sym3(TM) Etch system, featuring an entirely new chamber for atomic-level precision manufacturing. To overcome within-chip feature variations, the Centris Sym3 system leapfrogs current tools to provide chipmakers with the control and precision needed to pattern and create densely packed 3D structures in advanced memory and logic chips.

From Applied Materials Inc. 14 Jul 2015

Applied Microstructures Announces Milestone Shipment of 100th Molecular Vapor Deposition Tool

Marking an important milestone for its Molecular Vapor Deposition (MVD®) technology, Applied Microstructures (AMST) today announced that it will ship its 100th tool to a semiconductor manufacturer in Asia next week. AMST technology and equipment is used to volume-produce MEMS devices found in smartphones, computers, automobiles, and products that enable the Internet of Things (IoT).

14 Jul 2015

Nanofabrication News

ProPlus Design Solutions’ SPICE Simulator Selected by eSilicon for 28/16nm IP Designs

Xilinx Offers Vivado Design Suite Early Access Support for 16nm UltraScale+ Portfolio

II-VI Advanced Materials Exhibits World's First 200mm SiC Substrates at 2015 CS MANTECH Conference

Oxford Instruments and Lancaster University to Develop Ultra Low Temperature Systems for Quantum Sensors with UK Funding

Entegris Releases Torrento X Series 7nm Filters with FlowPlane Linear Filtration Technology

imec Demonstrates Pore-Sealing Low-K Dielectrics in Advanced Interconnects at SEMICON West

SEMICON WEST 2015: imec and Besi Develop Automated Thermocompression Solution for Narrow-Pitch Die-to-Wafer Bonding

CEA-Leti Announces Feasibility of CoolCube in FinFET Technology on 300mm Production Line

Applied Materials Introduces Centris Sym3 Etch System with New Chamber for Atomic-Level Precision Manufacturing

Applied Microstructures Announces Milestone Shipment of 100th Molecular Vapor Deposition Tool

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Combining Nanofluids and Turbulators for Sustainable Energy

Multiscale Force Sensing with Photon-Avalanching Nanocrystals

Enhancing Material Properties through Nanotube Encapsulation

Breakthrough in 2D Material Growth Opens Doors to Cleaner Energy and Next-Generation Technology

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

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