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TSMC Certifies Cadence Digital and Custom/Analog Tools for 16FF+ Process

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that its digital and custom/analog tools have achieved V0.9 Design Rule Manual (DRM) and SPICE certification from TSMC for its 16FF+ process, enabling systems and semiconductor companies to take advantage of the 15 percent speed improvement with the same total power compared to 16nm FinFET, or 30 percent total power reduction at the same speed compared to 16nm FinFET.

From Cadence Design Systems 29 Sep 2014

Toshiba Introduces Extremely Low-Power 2.4 GHz VCO using 28nm CMOS Technology

Toshiba Corporation today announced that it has developed an extremely low-power 2.4 GHz Voltage Controlled Oscillator (VCO) for low-power wireless systems, such as Bluetooth® Low Energy (BLE).

29 Sep 2014

Cadence Introduces Broad Portfolio of IP for TSMC’s 16nm FinFET Plus Process

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced a broad portfolio of intellectual property (IP) for TSMC’s 16nm FinFET Plus (16FF+) process.

From Cadence Design Systems 29 Sep 2014

Veeco’s EPIK700 MOCVD System Accepted by Epistar for High Volume LED Production

Veeco Instruments Inc. announced today that Epistar Corporation has successfully evaluated and accepted the new TurboDisc® EPIK700™ Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) system for the production of light emitting diodes (LEDs).

29 Sep 2014

TSMC Certifies Mentor Graphics’ AFS Mega, Eldo Platforms for 16nm FinFET+ Processes

Mentor Graphics Corp. today announced that the Analog FastSPICE (AFS™) Platform including AFS Mega and Eldo® have been certified for 16nm FinFET+ V0.9 process technology through TSMC's SPICE Simulation Tool Certification Program, and on-going certification of V1.0 is on track to be completed by November, 2014.

29 Sep 2014

Research on Nanowire-Based TFETs May Help Reduce Power Consumption of Electronics

TSMC today announced that its collaboration with HiSilicon Technologies Co, Ltd. has successfully produced the foundry segment's first fully functional ARM-based networking processor withFinFET technology.

29 Sep 2014

The Inkjet Conference: Phoseon to Showcase Advanced UV LED Curing Solutions

Phoseon will be displaying state of the art UV LED curing solutions for printing applications at The Inkjet Conference™ (TheIJC.com), to be held in the Swissôtel in Neuss (Düsseldorf), Germany, September 30 and October 1, 2014.

29 Sep 2014

TSMC Certifies Comprehensive List of Synopsys Digital Design Tools for 16-nm FinFET+ Processes

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that TSMC has certified a comprehensive list of Synopsys' custom and digital design tools for their 16-nm FinFET+ processes.

From Synopsys, Inc. 26 Sep 2014

New Nanoscale Structure Increases Brightness and Efficiency of Organic LEDs

Princeton University researchers have developed a new method to increase the brightness, efficiency and clarity of LEDs, which are widely used on smartphones and portable electronics as well as becoming increasingly common in lighting.

26 Sep 2014