Nanofabrication News

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SilTerra and CMT Release MTP Embedded Non-Volatile Memory Solution in 110nm High Voltage Technology

SilTerra Malaysia Sdn. Bhd., a Malaysian home grown leading semiconductor wafer foundry, and Chip Memory Technology, Inc, an innovative memory IP design house, jointly announced today the production release of Multiple-Time-Programming (MTP) embedded non-volatile memory solution in SilTerra’s advanced 110nm High Voltage technology.

7 Nov 2013

Luna to License Exclusive Rights to UltraTech to Commercialize Nanostructured Textile Repellent Technology

Luna Innovations Incorporated today announced an agreement granting UltraTech International Incorporated an exclusive license to commercialize Luna’s new textile repellent technology that can protect first responders from pathogens and industrial workers from contaminants, as well as address the common problem of keeping fabric clean.

7 Nov 2013

Focused Ion Beam Laser with Nano Techniques to Test Imperfections in Chips for CubeSats

Three Appalachian State University engineering physics majors have been selected to work with Goddard Space Flight Center scientists on a two-year, nearly $300,000 project funded by NASA’s Smallsat Technology Development Program.

6 Nov 2013

ProPlus Design Solutions to Feature FinFET-Ready DFY Products at Technology Symposiums

Will feature its FinFET-ready DFY products that range from nano-scale SPICE modeling to giga-scale SPICE simulations at the 2013 ProPlus Technology Symposiums in Shanghai, China, and Hsinchu City, Taiwan. Dr. Chenming Hu, TSMC distinguished professor of the Graduate School at the University of California, Berkeley, will be the keynote presenter at the Shanghai symposium and offer a perspective on the 3D FinFET transistor he and his team invented.

5 Nov 2013

Lego-Like Nanoscale DNA Building Blocks Used to Build Membrane-Crossing Pores

A new way to build membrane-crossing pores, using Lego-like DNA building blocks, has been developed by scientists at UCL, in collaboration with colleagues at the University of Cambridge and the University of Southampton.

5 Nov 2013

Toshiba Unveils New Embedded NAND Flash Memory Modules with 19nm Process Technology

Toshiba Corporation today announced the launch of new embedded NAND flash memory modules integrating NAND chips fabricated with 19nm second generation process technology. The module is fully compliant with the latest e•MMCTM [1] standard, and is designed for application in a wide range of digital consumer products, including smartphones, tablet PCs and digital video cameras. Mass production will start from the end of November.

31 Oct 2013

Georgia Researchers Develop High-Performance Barrier Films Using Atomic Layer Deposition

A new type of "good cholesterol," made in the lab, could one day deliver drugs to where they are needed in the body to treat disease or be used in medical imaging, according to scientists. Their report on the high-density lipoprotein (HDL) mimic, which is easy to make in large amounts, appears in the journal ACS Nano.

From Georgia Institute of Technology 31 Oct 2013

Researchers Studying Silicon Wafer Etching with Atomic Precision Funded by NSF Grant

How’s this for precision? Researchers with the University of Houston Cullen College of Engineering are developing technology to knock single atoms off a silicon wafer without disturbing atoms of other materials nearby.

31 Oct 2013

PAMS Project Aims to Design Sub-Nanometer Range Electronic Components

Professor Angelika Kühnle and her work group at the Institute of Physical Chemistry at Johannes Gutenberg University Mainz (JGU) are participating in a new EU project focusing on information and communication technology. Over the next four years, a total of eight partners from six European countries will be involved in the "Planar Atomic and Molecular Scale Devices" (PAMS) project.

30 Oct 2013

Sigma Designs Selects Sidense SHF NVM Macros for 40nm Product Implementation

Sidense Corp., a leading developer of Logic Non-Volatile Memory (LNVM) OTP IP cores, today announced that Sigma Designs®, a leading provider of System-on-Chip (SoC) solutions for converging multimedia delivery of home entertainment, home control, and connectivity, has selected Sidense 1T-Fuse™-based 1T-OTP memory IP for use in their next generation DTV and home entertainment product lines.

30 Oct 2013

Nanofabrication News

SilTerra and CMT Release MTP Embedded Non-Volatile Memory Solution in 110nm High Voltage Technology

Luna to License Exclusive Rights to UltraTech to Commercialize Nanostructured Textile Repellent Technology

Focused Ion Beam Laser with Nano Techniques to Test Imperfections in Chips for CubeSats

ProPlus Design Solutions to Feature FinFET-Ready DFY Products at Technology Symposiums

Lego-Like Nanoscale DNA Building Blocks Used to Build Membrane-Crossing Pores

Toshiba Unveils New Embedded NAND Flash Memory Modules with 19nm Process Technology

Georgia Researchers Develop High-Performance Barrier Films Using Atomic Layer Deposition

Researchers Studying Silicon Wafer Etching with Atomic Precision Funded by NSF Grant

PAMS Project Aims to Design Sub-Nanometer Range Electronic Components

Sigma Designs Selects Sidense SHF NVM Macros for 40nm Product Implementation

Biochar-Modified Titanium Dioxide Nanocomposites for Enhanced Water Treatment

Gold Nanoparticles to Restore Vision in Retinal Disorders

New Nanocage Material Removes Up to 90% of Toxic PFAS from Water

Enhancing Chitosan Films with Silanized Hexagonal Boron Nitride for Sustainable Applications

Light-Induced Symmetry Shifts Enable New Advances in Nanomaterials

Overcoming Nanogold Production Challenges

Electrospinning and the Future of Nanotechnology

How Electrospinning is Shaping the Future of Nanotechnology

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