Nanofabrication News

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Toshiba Unveils New Embedded NAND Flash Memory Modules with 19nm Process Technology

Toshiba Corporation today announced the launch of new embedded NAND flash memory modules integrating NAND chips fabricated with 19nm second generation process technology. The module is fully compliant with the latest e•MMCTM [1] standard, and is designed for application in a wide range of digital consumer products, including smartphones, tablet PCs and digital video cameras. Mass production will start from the end of November.

31 Oct 2013

Georgia Researchers Develop High-Performance Barrier Films Using Atomic Layer Deposition

A new type of "good cholesterol," made in the lab, could one day deliver drugs to where they are needed in the body to treat disease or be used in medical imaging, according to scientists. Their report on the high-density lipoprotein (HDL) mimic, which is easy to make in large amounts, appears in the journal ACS Nano.

From Georgia Institute of Technology 31 Oct 2013

Researchers Studying Silicon Wafer Etching with Atomic Precision Funded by NSF Grant

How’s this for precision? Researchers with the University of Houston Cullen College of Engineering are developing technology to knock single atoms off a silicon wafer without disturbing atoms of other materials nearby.

31 Oct 2013

PAMS Project Aims to Design Sub-Nanometer Range Electronic Components

Professor Angelika Kühnle and her work group at the Institute of Physical Chemistry at Johannes Gutenberg University Mainz (JGU) are participating in a new EU project focusing on information and communication technology. Over the next four years, a total of eight partners from six European countries will be involved in the "Planar Atomic and Molecular Scale Devices" (PAMS) project.

30 Oct 2013

Sigma Designs Selects Sidense SHF NVM Macros for 40nm Product Implementation

Sidense Corp., a leading developer of Logic Non-Volatile Memory (LNVM) OTP IP cores, today announced that Sigma Designs®, a leading provider of System-on-Chip (SoC) solutions for converging multimedia delivery of home entertainment, home control, and connectivity, has selected Sidense 1T-Fuse™-based 1T-OTP memory IP for use in their next generation DTV and home entertainment product lines.

30 Oct 2013

Kilopass Anti Fuse OTP eNVM Completes JEDEC Testing for GLOBALFOUNDRIES’ 40nm Low Power Process Technology

Kilopass Technology Inc., a leading provider of logic embedded non-volatile memory (eNVM) intellectual property (IP) and a GLOBALSOLUTIONS Partner, today announced that its entire product line of anti fuse one-time programmable (OTP) eNVM has completed 1000 hours of JEDEC standard reliability testing for GLOBALFOUNDRIES’ 40nm low power process technology.

30 Oct 2013

sureCore’s SRAM IP Demonstrator Chip Taped Out in STMicroelectronics’ 28nm FD-SOI Process

sureCore Ltd has announced that it has taped out its low power SRAM IP demonstrator chip in STMicroelectronics’ 28nm Fully Depleted Silicon-on-Insulator (FD-SOI) process. The device will validate the benefits of sureCore’s patented array control and sensing scheme, which significantly lowers active power consumption to deliver greater than 50% power savings compared to current offerings in the same process.

30 Oct 2013

NSF Awards CWRU $424,000 Grant to Streamline Manufacturing for Two-Sided Nanoparticles

A pair of Case Western Reserve University researchers have received a $424,000 grant from the National Science Foundation's Division of Civil, Mechanical and Manufacturing Innovation, to streamline manufacturing and assembly for two-sided nanoparticles.

29 Oct 2013

AIXTRON Participates in European Graphene Flagship Projects

AIXTRON, a leading supplier to the semiconductor and lighting industries, is investing in the development of deposition systems for graphene and advanced 2D materials.

From AIXTRON SE 29 Oct 2013

Nanoscale MOFs Enable Controlled Delivery of NO Gas into Cells

In a study published in Nature Communications, researchers in Japan describe a novel way to control the delivery of nitric oxide (NO) gas into cells.

28 Oct 2013

Nanofabrication News

Toshiba Unveils New Embedded NAND Flash Memory Modules with 19nm Process Technology

Georgia Researchers Develop High-Performance Barrier Films Using Atomic Layer Deposition

Researchers Studying Silicon Wafer Etching with Atomic Precision Funded by NSF Grant

PAMS Project Aims to Design Sub-Nanometer Range Electronic Components

Sigma Designs Selects Sidense SHF NVM Macros for 40nm Product Implementation

Kilopass Anti Fuse OTP eNVM Completes JEDEC Testing for GLOBALFOUNDRIES’ 40nm Low Power Process Technology

sureCore’s SRAM IP Demonstrator Chip Taped Out in STMicroelectronics’ 28nm FD-SOI Process

NSF Awards CWRU $424,000 Grant to Streamline Manufacturing for Two-Sided Nanoparticles

AIXTRON Participates in European Graphene Flagship Projects

Nanoscale MOFs Enable Controlled Delivery of NO Gas into Cells

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Combining Nanofluids and Turbulators for Sustainable Energy

Breakthrough in 2D Material Growth Opens Doors to Cleaner Energy and Next-Generation Technology

Multiscale Force Sensing with Photon-Avalanching Nanocrystals

Enhancing Material Properties through Nanotube Encapsulation

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

Sponsored Content

Characterization of Active Pharmaceutical Ingredients, Injectables, and Proteins

The Future of Wound Care: Why Nanofibers are Key to Accelerated Healing

The Evolution of Lipid Nanoparticles

How Emulsion Electrospinning is Transforming Materials