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GLOBALFOUNDRIES Certifies Cadence PVS for 65nm to 14nm FinFET Process Technologies

Cadence Design Systems, Inc., a leader in global electronic design innovation, announced today that GLOBALFOUNDRIES certified the Cadence® Physical Verification System (PVS) for custom/analog, digital and mixed-signal design physical signoff for 65nm to 14nm FinFET process technologies.

From GlobalFoundries 13 Mar 2014

Surface Topography and Chemistry Can Influence Cellular Behavior on Semiconductors

Changing the texture and surface characteristics of a semiconductor material at the nanoscale can influence the way that neural cells grow on the material.

From North Carolina State University 13 Mar 2014

Cadence, GLOBALFOUNDRIES Tape Out Quad Core Test Chip Built Around ARM Cortex-A12 Processor

Cadence Design Systems Inc. and GLOBALFOUNDRIES announced that they have taped out a quad core test chip built around the ARM Cortex-A12 processor. Targeted to operate at frequencies of up to 2.0GHz while still within the mainstream mobile power and area envelope, the test chip is implemented in GLOBALFOUNDRIES’ 28nm-SLP (Super Low Power 28 nanometer High-K Metal Gate) process using a full Cadence® tool flow and incorporates ARM POP™ technology to leverage the full performance range of the 28-SLP process.

From GlobalFoundries 13 Mar 2014

IC Plus Selects Analog FastSPICE Platform for Full-Circuit Verification of their Mixed-Signal Ics

Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced that IC Plus Corporation, a communication and networking IC design company has selected the Analog FastSPICE Platform for full-circuit verification of their mixed-signal integrated circuits.

12 Mar 2014

Broadcom Unveils BCM82322 Lite-PHY Fabricated in 28nm CMOS Technology

Broadcom Corporation, a global innovation leader in semiconductor solutions for wired and wireless communications, today announced the industry's first triple speed 10/40/100G Lite physical layer transceiver (Lite-PHY) designed for high-density data center applications.

12 Mar 2014

CEA-Leti Fabricates Ultra-Scaled Split-gate Memories with Gate Length of 16nm

CEA-Leti announced today it has fabricated ultra-scaled split-gate memories with gate length of 16nm, and demonstrated their functionality, showing good writing and erasing performances with memory windows over 6V.

From CEA-Leti 12 Mar 2014

Research and Markets Adds International Functional Printing Market Report

Research and Markets has announced the addition of the "Concise Analysis of the International Functional Printing Market - Forecasts to 2020" report to their offering.

12 Mar 2014

Caltech Researchers Develop Novel Light-Bending Silicon Chip with Optical Phased Array

Imagine that you are in a meeting with coworkers or at a gathering of friends. You pull out your cell phone to show a presentation or a video on YouTube. But you don't use the tiny screen; your phone projects a bright, clear image onto a wall or a big screen. Such a technology may be on its way, thanks to a new light-bending silicon chip developed by researchers at Caltech.

12 Mar 2014

NanoIsrael 2014, 4th International Conference and Exhibition on March 24-25

NanoIsrael 2014, the 4th international conference & exhibition, which will be held on March 24th-25th , at the Tel–Aviv David Intercontinental Hotel, Israel, will focus this year on innovations and business opportunities in the fields of medicine, materials, defence, electronics, photonics and energy.

11 Mar 2014

Samsung Electronics Mass Producing Advanced DDR3 Memory Based on 20nm Technology

Samsung Electronics Co., Ltd., the world leader in memory technology, today announced that it is mass producing the most advanced DDR3 memory, based on a new 20 nanometer process technology, for use in a wide range of computing applications.

From Samsung Electronics 11 Mar 2014

Nanoelectronics News

GLOBALFOUNDRIES Certifies Cadence PVS for 65nm to 14nm FinFET Process Technologies

Surface Topography and Chemistry Can Influence Cellular Behavior on Semiconductors

Cadence, GLOBALFOUNDRIES Tape Out Quad Core Test Chip Built Around ARM Cortex-A12 Processor

IC Plus Selects Analog FastSPICE Platform for Full-Circuit Verification of their Mixed-Signal Ics

Broadcom Unveils BCM82322 Lite-PHY Fabricated in 28nm CMOS Technology

CEA-Leti Fabricates Ultra-Scaled Split-gate Memories with Gate Length of 16nm

Research and Markets Adds International Functional Printing Market Report

Caltech Researchers Develop Novel Light-Bending Silicon Chip with Optical Phased Array

NanoIsrael 2014, 4th International Conference and Exhibition on March 24-25

Samsung Electronics Mass Producing Advanced DDR3 Memory Based on 20nm Technology

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Combining Nanofluids and Turbulators for Sustainable Energy

Multiscale Force Sensing with Photon-Avalanching Nanocrystals

Enhancing Material Properties through Nanotube Encapsulation

Breakthrough in 2D Material Growth Opens Doors to Cleaner Energy and Next-Generation Technology

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

Sponsored Content

Characterization of Active Pharmaceutical Ingredients, Injectables, and Proteins

The Future of Wound Care: Why Nanofibers are Key to Accelerated Healing

The Evolution of Lipid Nanoparticles

How Emulsion Electrospinning is Transforming Materials