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Teledyne Opts for Analog FastSPICE Platform from Berkeley Design Automation

Berkeley Design Automation, the provider of nanometer circuit verification solutions, has announced that Teledyne Technologies’ subsidiary, Teledyne Scientific & Imaging has opted for Berkeley’s Analog FastSPICE (AFS) platform for imaging sensor verification.

9 Aug 2012

Project on Nanostucturing and Plastic Electronics Print Platform Moves to Second Phase

Heidelberger Druckmaschinen, BASF SE and TU Darmstadt are happy with the first phase results of the joint research project "Nanostructuring and plastic electronics print platform" (NanoPEP) and are determined that they will go on with their combined work. Participating researchers have been working on functional materials based on nanotechnology and related novel printing techniques for processing of these from the summer of 2009.

3 Aug 2012

Applied Nanotech Introduces Microcopper Ink Material for Printed Electronics Applications

Applied Nanotech has unveiled a new micron copper particle-based ink material to directly print electronic circuits at a lower cost for display devices, solar cells, mobile devices, and much more.

From Nano Magic, LLC. 3 Aug 2012

New Transistor Enables Electrical Switching of State of Matter

A research team at the RIKEN Advanced Science Institute has created a first-of-its-kind transistor that utilizes the electrostatic build-up of electrical charge on a strongly-correlated material’s surface to activate bulk transformation of electronic state.

27 Jul 2012

Polyonics Rolls Out New Flexible Substrates for Printed Electronics

Polyonics has unveiled a new line of clear and white top coated polyimide flexible substrates called PolyFLEX for use in the printed electronics industry. This family of substrates allows printing with resistive, conductive and semi-conductive inks.

27 Jul 2012

German Researchers to Use Oxford Instruments Plasma Etch Tool for HBLED Development

A leader in plasma etch and deposition systems for research and industry, Oxford Instruments has recently received an order for a PlasmaPro® System100 ICP180 etch tool to the Otto-von-Guericke University Magdeburg in Germany, to facilitate its Power Semiconductor and HBLED research programme. The system will run GaN on Si etch processes to enable this research.

From Oxford Instruments Plasma Technology 27 Jul 2012

UK Researchers Devise First Scalable 3D Ion Microtrap

Researchers at UK’s National Physical Laboratory (NPL) have devised the first three-dimensional ion microtrap that is scalable to handle many tens of ions serving as quantum bits (qubits).

26 Jul 2012

Intel Invests in ASML to Advance EUV Light Technology

The semiconductor industry is working on the development of cost-effective technique to etch microscopic features onto microchips. The ultimate solution could be the extreme-ultraviolet (EUV) lithography technique that utilizes very-short-wavelength light to etch features that are four folds finer when compared to existing microchips. However, the industry requires huge investment to overcome the physics, chemistry and engineering challenges.

25 Jul 2012

IMEC and Pacific Biosciences Collaborate to Produce Advanced Microchip for Genetic Sequencing

Pacific Biosciences of California, Inc., provider of the PacBio RS High Resolution Genetic Analyzer, and Belgium-based nanoelectronics research center imec today announced a multi-year research collaboration focused on the development of advanced microchips for highly multiplexed single molecule genetic analysis.

From IMEC 23 Jul 2012

Griffith University Researchers Receive Funds to Develop Silicon Carbide Microchip Production Processes

The Queensland Government has granted a research funding worth $1 million to the Queensland Micro- and Nanotechnology Centre of the Griffith University to devise manufacturing techniques for a silicon carbide microchip.

17 Jul 2012

Nanoelectronics News

Teledyne Opts for Analog FastSPICE Platform from Berkeley Design Automation

Project on Nanostucturing and Plastic Electronics Print Platform Moves to Second Phase

Applied Nanotech Introduces Microcopper Ink Material for Printed Electronics Applications

New Transistor Enables Electrical Switching of State of Matter

Polyonics Rolls Out New Flexible Substrates for Printed Electronics

German Researchers to Use Oxford Instruments Plasma Etch Tool for HBLED Development

UK Researchers Devise First Scalable 3D Ion Microtrap

Intel Invests in ASML to Advance EUV Light Technology

IMEC and Pacific Biosciences Collaborate to Produce Advanced Microchip for Genetic Sequencing

Griffith University Researchers Receive Funds to Develop Silicon Carbide Microchip Production Processes

Combining Nanofluids and Turbulators for Sustainable Energy

Enhancing Material Properties through Nanotube Encapsulation

Brain-Inspired Nano-Tech Promises New Era for Electronics

Breakthrough in 2D Material Growth Opens Doors to Cleaner Energy and Next-Generation Technology

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Electrospinning and the Future of Nanotechnology

How Electrospinning is Shaping the Future of Nanotechnology

Conversations on AFM: Applications of BioAFM in Life Science

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Characterization of Active Pharmaceutical Ingredients, Injectables, and Proteins

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The Evolution of Lipid Nanoparticles

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