Nanoelectronics News

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New Partnership to Develop Efficient and Eco-Friendly Cleaning Solutions for Microelectronics

Fraunhofer Center Nanoelectronic Technologies (CNT) in Dresden has inked a two-year partnership deal with bubbles & beyond, a technology firm specializing in tailored intelligent fluids, to create novel cleaning solutions for use in the microelectronics industry.

9 Mar 2012

Self-Assembling Proteins Help Develop Next-Generation Nanotechnologies

A research team from the Tel Aviv University’s The Center for Nanoscience and Nanotechnology and Department of Chemistry has developed protein-based transistors from organic materials present in the human body utilizing several advanced techniques.

9 Mar 2012

Thin Film Electronics Receives First Order for Thinfilm Passive Array Memory

Thin Film Electronics has received its first order for Thinfilm Passive Array Memory. The memory is rewritable, printable and non volatile that can be applied in value cards, secure documents and more.

9 Mar 2012

Fujitsu Laboratories of America Selects Analog FastSPICE Nanometer Circuit Verification Platform

Berkeley Design Automation has announced that Fujitsu Laboratories’ subsidiary, Fujitsu Laboratories of America has chosen Berkeley Design Automation’s Analog FastSPICE Platform, which is recognized as the fastest nanometer circuit verification platform in the world for RF, analog, mixed-signal and custom digital circuits.

9 Mar 2012

Major Chip Manufacturer Places Order for ANTARES Single-Wafer Cleaning Systems

FSI International, a provider of surface conditioning technology, devices and support services for the production of microelectronics, has informed that it has received a follow-on order from a major device manufacturer for multiple ANTARES single-wafer cryokinetic cleaning systems.

8 Mar 2012

FlipChip International, NANIUM Ink Strategic Deal for 300 mm WLP and Bumping Services

FlipChip International, a specialist in wafer level packaging (WLP) and flip chip bumping, has inked license, sales and marketing deals with NANIUM, a provider of production, engineering and testing services in the semiconductor industry, for 300 mm WLP and flip chip bumping.

8 Mar 2012