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STPS Completes Shipment of its 600th Advanced Vertical Processor for LPCVD Systems

STPS Completes Shipment of its 600th Advanced Vertical Processor for LPCVD Systems

Samsung Announces Development of 30 nm Class Process-Based LPDDR3 DRAM

Samsung Announces Development of 30 nm Class Process-Based LPDDR3 DRAM

Asian Foundry Producer to Adopt FSI International’s ORION Single Wafer Cleaning System

Asian Foundry Producer to Adopt FSI International’s ORION Single Wafer Cleaning System

Samsung Unveils 32 nm HKMG Logic Low Power Process-Based Application Processor

Samsung Unveils 32 nm HKMG Logic Low Power Process-Based Application Processor

Crossing Automation Launches Spartan 450 for Wafer Production

Crossing Automation Launches Spartan 450 for Wafer Production

Oxford Instruments Present Inaugural Award for Best MSc Project in Nanotechnology

Oxford Instruments Present Inaugural Award for Best MSc Project in Nanotechnology

D2S Introduces Mask-Wafer Double Simulation Workstation for 20-nm-Node and Below Designs

Comprehensive Database on Wafer Level Packaging Activity and Installed Capacities

Comprehensive Database on Wafer Level Packaging Activity and Installed Capacities

NSF and Semiconductor Research to Fund 12 Nanoelectronics Research Grants

NSF and Semiconductor Research to Fund 12 Nanoelectronics Research Grants

CEA-Leti Includes Synopsys in IMAGINE Program on Maskless Lithography

CEA-Leti Includes Synopsys in IMAGINE Program on Maskless Lithography

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