Sidense Corp., a leading developer of non-volatile memory OTP IP cores, today announced that the Company's SHF 1T-OTP macros for GLOBALFOUNDRIES 28nm HPP and SLP processes have met all of GLOBALFOUNDRIES qualification requirements. Applications for Sidense SHF memory IP include code storage, ROM replacement, secure encryption key storage, configuration, fuse replacement, trimming and calibration in networking, mobile computing and communications, IoT, automotive and industrial applications.
Brown University researchers have developed a new method of producing new 2D multilayered graphene-like semiconductor materials in different shapes and orientations using silicon.
The process of trial and error in scientific research is costly and time-consuming. And while scientific innovation and discovery is necessary to find solutions to some of society’s largest challenges — think clean energy, national security, more accessible technologies —the development of new, more efficient materials typically take decades and millions of dollars.
The word “defect” doesn’t usually have a good connotation--often indicating failure. But for physicists, one common defect known as a nitrogen-vacancy center (NV center) has applications in both quantum information processing and ultra-sensitive magnetometry, the measurement of exceedingly faint magnetic fields.
Sandia National Laboratories has begun making silicon wafers for three nuclear weapon modernization programs, the largest production series in the history of its Microsystems and Engineering Sciences Applications complex.
In accordance with Governor Andrew M. Cuomo’s commitment to furthering New York State’s global leadership in nanoelectronics innovation and commercialization, SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE) today announced it will host the first ever Northeast Semi Supply Conference (NESCO) on Wednesday, April 15, 2015 at its NanoTech Megaplex in Albany, New York.
Scientists from Europe’s Graphene Flagship have discovered the ability of graphene to provide effective microwave shielding, opening the door to use this two-dimensional material for reduction of microwave pollution and improvement of electromagnetic compatibility of upcoming nanoscale electronic devices.
NTT Electronics (NEL), a leading supplier of coherent Digital Signal Processor (DSP) solutions to system and module manufacturers worldwide, today announced that its second generation Low-Power DSP product, NLD0640 Gen2 LP-DSP, is now generally available for manufacturers, and is shipping thousands of the new LP-DSP Integrated Circuits (IC's) in its first quarter to fifteen manufacturers worldwide for upgrading and/or downsizing their optical module and system. Its confirmed interoperability among multi-source 100G pluggable coherent optics drives the industry into high-port-density 100G Metro deployments.
Cadence Design Systems Inc. and Intel Corporation today announced that the two companies have delivered a 14nm (nanometer) library characterization reference flow for customers of Intel Custom Foundry, continuing their collaboration on enabling digital and custom/analog flows for the Intel 14nm platform.
Nano Labs Corp. is pleased to announce today the Company has entered into a Joint Venture Agreement with the ET3M Group (ET3M) to launch a Market Development Program (MDP) to develop, design, manufacture and sell applications of the ET3M Group's technology.
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