Jul 8 2010
Pall Corporation (NYSE: PLL) today announced a next-generation, highly asymmetric membrane technology for semiconductor fabrication that advances wet chemical filtration performance to a level of 10 nanometers and reduces energy costs. The new Pall Ultipleat® SP DR series filter cartridge will be unveiled at SEMICON West 2010, the flagship annual event for the global microelectronics industry, taking place in San Francisco from July 13-15, booth 1721.
“Pall’s new Ultipleat SP DR series filter reduces defects and improves productivity by increasing filtration efficiency in Front End of Line (FEOL) wet chemical surface preparation processes,” said Jon Weiner, president, Pall Microelectronics. “This includes critical pre-clean stages where removal of a ’killer defect’ particle size down to 10 nanometers is required.”
Surface preparation entails wet chemical cleaning to remove contamination at numerous stages of the semiconductor device fabrication process. The ultra-clean Ultipleat SP DR membrane material is compatible with typical surface preparation and cleaning chemistries to 70 Degrees Celsius.
The filter’s patented membrane technology boosts filtration performance nearly 50% over current filter designs. It uses an advanced non-fluoropolymer material that provides a chemically resistant and more hydrophilic alternative to all-fluoropolymer filters. The proprietary graded pore structure achieves 10-nanometer retention while the high fluid permeability reduces the load on pumps, thereby lowering energy costs.
“The new Ultipleat SP DR filter is part of Pall’s ongoing commitment to help microelectronics customers address their contamination control and sustainability challenges in next-generation applications with novel chemical filtration technologies,” said Jon Weiner.
Pall Microelectronics supports the solar energy, semiconductor, data storage, fiber optic, display, solar and materials markets with a comprehensive suite of contamination control solutions for chemical, gas, water, chemical mechanical polishing (CMP) and photolithography processes.
Source: http://www.pall.com/