Jul 9 2010
Pall Corporation (NYSE:PLL), a finalist for the coveted SEMICON West Sustainable Technologies Award, will showcase its expanding line of green filtration and purification technologies for microelectronics manufacturers from July 13th-15th at SEMICON West.
Pall will display its latest offerings for semiconductor production at the industry's flagship event at the Moscone Center in San Francisco. These new products are designed to remove barriers to innovation, lower operating costs and to be more environmentally benign, growing imperatives for this technically demanding and fast-moving industry.
At SEMICON, Pall will introduce its new PhotoKleen(TM) EZD-3XL filter, which more than triples the area of standard photolithography filters and permits finer filtration, along with other products to improve efficiencies and profitability in semiconductor production.
Advanced 10 nm Filtration Membrane for Wet Chemical Processing
A key innovation in Pall’s line-up for SEMICON West is the new 10 nanometer (nm), Pall Ultipleat® SP DR series filter cartridge, an advanced membrane technology for semiconductor manufacturing that boosts filtration performance nearly 50% over current filter designs. The Ultipleat SP DR filter reduces defects and improves productivity by increasing filtration efficiency during critical, wet chemical surface preparation processes. Pall’s proprietary membrane design can quantitatively retain particles 10 nm and larger in a single filtration step, while maintaining the high fluid permeability of larger-pore filters.
“Pall’s ongoing strategy is to help microelectronics customers address their contamination control challenges for 32 nm and 22 nm node devices with novel filtration technologies,” said Dr. Vivien Krygier, Ph.D., senior vice president, marketing, Pall Microelectronics. “The Ultipleat SP DR filter exemplifies the performance improvement and energy savings that is typical of our new products.”
High Area Filter Assembly for Photolithography
Also at the SEMICON exhibition, Pall will introduce its new PhotoKleen™ EZD-3XL filter for photolithography applications. The filter more than triples the area of standard photolithography filters, permitting finer filtration while maintaining low differential pressure. It is designed for high throughput systems capable of processing up to 300 silicon wafers per hour. The PhotoKleen EZD-3XL filter is available in three different media types and consists of a quick-disconnect manifold and capsule, enabling fast, safe and easy filter change-outs. The new design extends filter life, thereby reducing the frequency of change-outs as well as the amount of associated photoresist waste.
Advanced Chemical Mechanical Polishing (CMP) Filtration
Another featured Pall product will be the company’s new Profile® Nano filter for advanced chemical mechanical polishing (CMP) processes, such as shallow trench isolation (STI) and barrier copper. The Pall Profile Nano filter contains extremely fine fibers that improve particle removal efficiency to better than 99 percent at 200 nm. The filter improves yield and reduces the need for reworking, lowering production costs.
New Gas Purification and Filtration Products
Pall will debut two new media for Pall’s Gaskleen® purifier assemblies targeting clean dry air (CDA), used in photolithography stepper purge gas, and hydrogen bromide gas, key in polysilicon plasma etching. In contrast to other technologies, Pall purifiers operate at room temperature, eliminating the need for energy-intensive heating or cooling sources. The company will also showcase a new Gasket-Sert™ PSP filter with a W-seal gasket to protect gas panel components in semiconductor grade gas distribution systems.
“Pall provides filtration and purification solutions for a broad range of fluids in semiconductor applications, such as chemicals, gas, water, CMP slurries and photoresist. Our solutions help our customers improve the efficiency and profitability of their manufacturing processes,” Dr. Krygier said.
Source: http://www.pall.com/