FSI International, a provider of surface conditioning device for production of microelectronics, has declared that it has received multiple orders for its ANTARES cryokinetic cleaning system from several semiconductor manufacturers.
ANTARES Single-Wafer Cryokinetic Cleaning System
At present, the ANTARES cryokinetic cleaning systems have been utilized by semiconductor device manufacturers for various particle stripping processes. Cryokinetic cleaning technology is suitable for particle stripping applications due to its all-dry flaw removal process. The shipment of the systems is anticipated during the fiscal year 2012.
The ANTARES, a single-wafer, completely automated cryokinetic cleaning system with capabilities to strip nano-scale particles is utilized for processing wafers having sizes of 200 and 300 mm. Cryokinetic processing technology is a zero-chemical, all-dry process that strips particles using the force of high-velocity cryogenic Ar/N2 aerosol, and decreases imperfections even on low-k porous films and copper without damaging the surface of wafer. The high-efficiency, dry cleaning capability of the system can be utilized for numerous particle stripping applications in the back-end-of-line and front-end-of-line.
Due to its yield enhancement and flaw reduction advantages, the ANTARES cryokinetic cleaning system has been utilized by most of the major logic device producers across the world. FSI International offers a variety of cleaning products such as cryogenic aerosol technologies, spray aerosol technologies, and single- and batch-wafer systems for immersion to enhance the performance and productivity of its customers.