CMP Barrier Slurry with Tunable Copper, Barrier and Dielectric Polishing Rates for use with Advanced Technology Nodes

DuPont Air Products NanoMaterials L.L.C., a joint venture of DuPont and Air Products , recently launched a non-selective chemical mechanical planarization (CMP) barrier slurry with tunable copper, barrier and dielectric polishing rates for use with advanced technology nodes.  CMP utilizes mechanical and chemical means in the removal of various dielectric and metal layers used in the integrated circuit manufacturing process.

CMP slurries are comprised of fine abrasive particles dispersed in water along with chemical additives.  They are used to polish the surfaces of electronic substrates and devices to smooth finishes.  DA NanoMaterials' newest slurry offering will be marketed under the CoppeReady® Cu6545 trademark, joining other slurries the joint venture markets under its MicroPlanar®, Syton® and Mazin® trademarks.

“The CoppeReady® Cu6545 barrier slurry is a family of products designed to provide tailored solutions to our customers for advanced technologies, both for logic and memory applications,” said Edward Shober, CEO, DA NanoMaterials.  “The slurry utilizes highly engineered abrasives and unique chemistries that offer enhanced capabilities to optimize selectivities and provide superior defect performance, while delivering a cost effective solution.”