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Results 1 - 5 of 5 for Nanoelectromechanical systems
  • DXB Wafer Bonder from Dynatex International
    Equipment
    The DXB is used for mounting wafer to substrate improves bond quality and repeatability while improving process time during lapping, polishing, or dicing.
  • SB6/8e Semi-Automated Wafer Bonding System from SÜSS MicroTec AG
    Equipment
    The SB6/8e is a semi-automatic, computer controlled, stand-alone wafer bonder accommodating 150mm and 200mm wafers respectively. The SB6/8e system features a rigid vacuum chamber for best-in-class...
  • The Vistec SB3050-2 Variable Shaped Beam System
    Equipment
    The Vistec SB3050-2 is the most advanced electron beam lithography system with variable-shaped beam technology, allowing a wide range of applications in research and development, prototyping, and...
  • High Performance Electron-beam Lithography System SB254
    Equipment
    The Vistec SB254 is an advanced electron-beam lithography system that allows the usage for direct write and mask making for a wide range of applications.
  • NanoLith 7000 from Cymer Inc.
    Equipment
    A fourth-generation design, the NanoLithTM 7000 provides the required output power and stability while providing a highly line-narrowed bandwidth to meet the stringent requirements of high volume...

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