MEMS - NEMS News

RSS

ROHM Establishes MEMS Process Utilizing Thin-Film Piezoelectric Elements

ROHM has recently established a process for MEMS (Micro Electro Mechanical System) utilizing thin-film piezoelectric elements, and implemented the industry's first* foundry business that integrates product design and manufacturing processes, from wafer pulling to mounting, in order to meet a variety of customer needs.

28 Aug 2014

CardioMEMS HF System Helps Doctors and Patients Manage Heart Failure

Unexpected trips to the hospital are inconvenient and worrisome for anyone, but for congestive heart failure sufferers, they can be all too frequent. In a rural state like West Virginia, distance can be a factor.

27 Aug 2014

Bosch Sensortec in Collaboration with ASE Introduces Tiny 3-Axis MEMS Accelerometer

Advanced Semiconductor Engineering, Inc., the world's largest semiconductor assembly and test service provider, today announced that it has been selected by Bosch Sensortec GmbH as a key manufacturing and technology partner for production of a leading edge sensor device.

27 Aug 2014

New MEMS WLP-Based Monolithic 3D Accelerometer from MEMSIC

MEMSIC, Inc., a leading MEMS sensing solution provider, announced today the availability of its MXC400xXC, the world's first monolithic 3D accelerometer, and also the first 3D accelerometer to utilize WLP technology.

From MEMSIC Inc. 18 Aug 2014

Bluechiip and STMicroelectronics Transition to High-Volume Production for MEMS-Based Tracking Tags

Australian technology company, Bluechiip Limited and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, the world's top MEMS (Micro-Electro-Mechanical Systems) manufacturer and the leading supplier of MEMS for devices in consumer and mobile applications1, today announced the transition to high-volume production for their jointly developed, unique MEMS-based tracking tags with the ability to meet demand in excess of 1 million tags a year.

From STMicroelectronics 11 Aug 2014

New Report on DIC & 2.5D TSV Interconnect for Advanced Packaging

Research and Markets has announced the addition of the "3DIC & 2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update" report to their offering.

From Research and Markets 6 Aug 2014

Electrostatically Actuated MEMS Microshutter Arrays as Functional as Magnetically Activated Arrays

NASA technologists have hurdled a number of significant technological challenges in their quest to improve an already revolutionary observing technology originally created for the James Webb Space Telescope.

30 Jul 2014

Global MEMS Pressure Sensor Market Forecast to Grow at 8.6% CAGR

Reportlinker.com announces that a new market research report is available in its catalogue: Global MEMS Pressure Sensors Market 2014-2018

30 Jul 2014

STMicroelectronics Establishes New MEMS Microphone Lab in Taiwan

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced it has opened a new MEMS Microphone Lab (Anechoic Chamber) in Taiwan to test and analyze high-performance audio applications built with ST's MEMS microphones.

From STMicroelectronics 26 Jul 2014

Novel Chemical Etching Process to Fabricate Custom Nanostructures for X-ray Optics

Scientists at the Department of Energy’s SLAC National Accelerator Laboratory have invented a customizable chemical etching process that can be used to manufacture high-performance focusing devices for the brightest X-ray sources on the planet, as well as to make other nanoscale structures such as biosensors and battery electrodes.

23 Jul 2014