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Comprehensive Report Discusses Recent Trends in Semiconductor Lithography Market

The Information Network has published a new report titled ‘The Global Market for Equipment and Materials for IC Manufacturing.’

4 Apr 2012

Diamond-Based Microelectronics Specialist AKHAN to Participate at XXI IMRC 2012

AKHAN Technologies, a specialist in designing sophisticated diamond electron devices, has declared that Adam Khan, the company’s Founder and Chief Executive Officer, will deliver a presentation at the Nanostructured Carbon Materials for MEMS/NEMS and Nano-Electronics Symposium at the upcoming XXI International Materials Research Congress (IMRC) 2012.

4 Apr 2012

Synopsys Announces New Partnership for Silicon-Validate Parasitic Modeling and Extraction of 28 nm Processes

Synopsys, a company offering intellectual property, software, and services utilized in the design, production and verification of electronic systems and components, has partnered with TSMC and Altera to deliver silicon-validate modeling of important parasitic effects in StarRC solution, developed by Synopsys, for TSMC’s 28-nm process nodes.

From Synopsys, Inc. 30 Mar 2012

Synopsys Achieves Major Milestone in 28 nm Silicon Process Technology Node

Synopsys declared that its parasitic extraction solution called StarRC has facilitated over 150 successful 28-nm tapeouts, providing the signoff accuracy and rapid turnaround time needed for next-generation of designs across applications such as mobile, consumer, computer and wireless communications.

From Synopsys, Inc. 30 Mar 2012

Smart Wing Created for UAV Model Using 3D Printing and Printed Electronics

Optomec and Stratasys have declared the completion of a joint development project, in which printed electronics and 3D printing were used to fabricate the first-of-its-kind fully printed hybrid structure.

27 Mar 2012

GLOBALFOUNDRIES Achieves Milestone by Supplying 32 nm HKMG Wafers

GLOBALFOUNDRIES disclosed that the company's Fab 1 located in Dresden, Germany has supplied 250,000 semiconductor wafers using 32 nm high-k metal gate (HKMG) technology. This is a major landmark, representing the company's competitive edge over other foundries using HKMG technology and its ability to ramp advanced technologies to mass production.

From GlobalFoundries 23 Mar 2012

Graphene-Based Ultracapacitors Help Develop High-Power Flexible Electronics

A research team from the University of California- Los Angeles (UCLA) has developed novel graphene-based electrodes with higher conductivity and surface area utilizing a typical LightScribe DVD optical drive.

17 Mar 2012

Twin Creeks Technologies Launches Ultra-Thin Wafer Production System

Twin Creeks Technologies, a provider of thin crystalline wafer manufacturing equipment for the semiconductor and solar industries, has launched the Hyperion production system for manufacture of ultra-thin wafers.

16 Mar 2012

Scientists Use Diamond-Based Nanoscale Materials to Improve Electronics’ Efficiency

The Argonne National Laboratory at the U.S. Department of Energy has conducted two new studies, which revealed a novel method to investigate the properties of nanocrystalline-diamond thin films. This latest discovery can pave the way to enhance the performance of specific types of integrated circuits, and this enhancement can be achieved by minimizing the "thermal budget" of the integrated circuits.

From Argonne National Laboratory 15 Mar 2012

ST-Ericsson Selects Soitec’s FD-SOI Wafer Technology for Future Mobile Platforms

Soitec, a manufacturer of innovative semiconductor materials for the energy and electronics industries, has revealed that its planar fully depleted silicon on insulator (FD-SOI) technology has been selected by ST-Ericsson for upcoming mobile platforms.

14 Mar 2012