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Advanced Micro-Fabrication Equipment’s Etch Tool for Critical Process Challenges at 22 nm and Beyond

Advanced Micro-Fabrication Equipment is unveiling its second-generation 300 mm ultra-high frequency advanced decoupled reactive ion etch (AD-RIE) system called the Primo AD-RIE tool, which is ideal for major process challenges at 22 nm and below at SEMICON West.

13 Jul 2011

Synopsys Collaborates With Samsung to Rollout 20 nm Test Chip

Synopsys, a company that provides IP and software to design and manufacture semiconductors, declared that its design enablement partnership with Samsung Electronics has resulted in the successful release of the 20 nm test chip implemented using the High-k metal gate (HKMG) process technology from Samsung.

13 Jul 2011

Entegris and CEA-Leti to Address Molecular Contamination Problems Between Semiconductor Wafers and Containers

Entegris and CEA-Leti have signed a two-year contract to observe cross-molecular contamination that occurs between semiconductor containers and wafers.

From CEA-Leti 13 Jul 2011

Samsung Uses Cadence Unified Digital Flow to Design Test Chip at 20 nm

Cadence Design Systems, a company that delivers electronic design solutions, declared that Samsung Electronics has introduced the Cadence unified digital flow for producing a test chip at 20 nm.

13 Jul 2011

Tanaka Kikinzoku Kogyo and SUSS MicroTec to Develop Wafer Bonding Technology

SUSS MicroTec will collaborate with Tanaka Kikinzoku Kogyo to develop bonding technology and pattern transfer with the help of gold particles of sub-micron dimensions.

13 Jul 2011

Synopsys Introduces IC Compiler Configuration to Support IC Manufacturing at 20 nm

Synopsys has introduced the IC Compiler-Advanced Geometry, a new version of its IC compiler, to provide design support for double-patterning technology (DPT), which serves as a pre-requisite for advanced silicon technology at 20 nm and imposes stringent restrictions on routing, placement and physical validation.

13 Jul 2011

SilconBlue Fabricates LP-Series and XP Series CMDs on TSMC 40nm CMOS Process

SiliconBlue Technologies, a manufacturer of custom mobile device (CMD) solutions, has declared that samples of the novel iCE40 Los Angeles mobileFPGA including low-power series (LP) for smartphones and the high-speed (HX–Series) for tablets are available and fully functional.

12 Jul 2011