Nov 8 2010
Intermolecular, Inc. announced today a new expanded collaborative development program (CDP) with Elpida Memory, Inc. (Tokyo SE:6665), a leading global memory supplier.
This new multi-year agreement focuses on research, development, manufacturing process transfer and high-volume yield-ramp support for multiple generations of DRAM technology. This agreement expands existing collaboration between the companies, which have worked together since 2007.
Engineers and technologists from both companies are working together at Intermolecular’s High-Productivity Combinatorial (HPC) R&D Center in California’s Silicon Valley using the proprietary HPC platform to increase experimental learning cycles by over 100X relative to conventional DRAM development methods. To ensure the efficient transfer of newly developed technologies into high-volume manufacturing, the joint teams are collaborating closely with Elpida’s production tool suppliers and their Hiroshima, Japan, production facility.
This engagement represents the most comprehensive collaboration to date between Elpida and Intermolecular. It includes near-term support for manufacturing process integration in 30 to 40 nanometer technology nodes, and future support for more advanced materials, process and integration development for DRAM technologies between 20 and 30 nanometers.
“Over the past few years, Intermolecular’s HPC technology and team members have become an important component of our DRAM R&D capability,” said Hideki Gomi, director and chief technology officer of Elpida. “We have seen new materials and processes move from early stage development into volume production with remarkable speed, and with significantly lower costs than would have been achieved in a more-traditional R&D model.”
“Elpida now makes some of the world’s most advanced memory devices, and the fact that we’re able to make a significant contribution to their R&D efforts is a source of great pride for our entire company,” said David Lazovsky, Intermolecular president and CEO. “This extension agreement is another demonstration of how our HPC innovation platform and collaboration model provide measurable competitive advantage to our customers. The product of our collaborations is accelerated time to market with differentiated, IP-protected technology that our customers have the ability to control.”
Source: http://www.intermolecular.com/