Superior Packaging of DRAM Devices to Deploy UniFire 7900 Metrology Platform of Nanometrics

Nanometrics declared that a Korean memory provider will deploy its UniFire 7900 metrology platform to monitor superior packaging of DRAM devices. The tool will be utilized to develop through-silicon via (TSV) technology that could enable future DRAM designs.

The UniFire tool provides multiple features to monitor redistribution layer(s), micro bump, and TSV patterning. It also enables measurement of critical dimensions (CD), etch and deposition processes, depth/height/profile and registration. It can also measure wafer bow, shape and thickness of the film.

According to Dr. Michael Darwin, vice president of the UniFire and Materials Characterization Groups at Nanometrics, the tool provides a non destructive, three-dimensional metrology feature to enable full surface topography monitoring and does not require multiple, stand alone metrology tools. It is critical to be able to measure micro bump, TSV and redistribution process accurately to obtain superior quality DRAM devices that can be used in future wafer scale packaging.