Leading Lithography Supplier Acquires Patents From IBM for Semiconductor Wafer Annealing

Ultratech, Inc., a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices, today announced that it has acquired the rights to a collection of patents from IBM -- these include fundamental patents around the area of rapid thermal annealing. Representing both U.S. and foreign patents, the portfolio includes hardware for thermal processing (annealing) of semiconductor wafers, as well as patents for temperature control and metrology. This acquisition strengthens and broadens Ultratech's annealing technology capability for ultra-shallow junction (USJ) formation -- a critical step in semiconductor manufacturing.

"Ultratech has periodically purchased patents that it views are key to our business," noted Ultratech Chairman and CEO Arthur W. Zafiropoulo. "The acquisition of these patents from IBM is the continuation of that strategy to ensure that our customers receive the highest technology content in their products. This acquisition reinforces our commitment to remain at the forefront of providing equipment with leading-edge technology and low cost-of-ownership advantages for our global customer base."