Dec 1 2010
Xradia Inc., the leading provider of high-resolution non destructive 3D X-ray imaging systems, announced today that its solutions for semiconductor failure analysis will be presented by its representative, Canon Marketing Group Japan, in CMJ's booth 3C-701 during Semicon Japan.
Representatives will discuss imaging solutions from 30 µm to 50 nm with its MicroXCT and UltraXRM computed tomography technology for a range of failure analysis issues.
"Semiconductor packaging is rapidly moving to a 3D state. It is logical that characterization and failure analysis should also be approached from a 3D perspective. Today's packages require X-ray vision," says Dr. Kevin Fahey, V.P. of Marketing at Xradia, Inc. "Our high resolution 3D X-ray imaging solutions make it possible to visualize buried problems without destroying the package, or inducing artifacts that have nothing to do with the actual condition of the package. By inspecting intact packages, we are able to isolate specific conditions that may be causing the failure."
Xradia solutions enable discovery of package failures from a myriad of conditions, including at multiple interfaces in complex 3D chip packages. Defects such as (C4) bump cracking and "invisible" non-wet defects, ball grid array (BGA) solder joint cracking, wirebond shorts and opens, micro voids and cracks at the substrate to bump and bump to pillar interface, bump alignment errors, Pb-free solder defects, cracked vias, delamination of the TSV trench and voids at the bottom of the TSV, etc. are all able to be imaged and analyzed. "We like to ask our customers, 'if you could see anything, what would you look for?' because at these levels of resolution and with a non-destructive process, they are able to see structures they've never seen before," added Fahey.
Xradia offers a multi-length scale computed tomography solution between two separate product lines for the analysis of semiconductor packages. The UltraXRM-L200 provides synchrotron-like imaging down to 50 nm resolution in a laboratory setting, the only instrument in its class. The MicroXCT product line offers a wide range of magnifications and field of view options with resolutions down to submicron length scales. MicroXCT products are available for both generic lab applications, and for environmental analysis and in situ experiments.
Xradia solutions are demonstrated to provide the highest image contrast for low to high Z materials, the highest resolution across sample sizes, and the versatility required for in situ analysis and short or long scans. The strength of the company's technology is inherent in its proprietary X-ray optics, developed over more than a decade for the world's most demanding customers.
Semicon Japan begins today and runs through December 3, 2010 at the Makuhari Messe International Exhibition Halls & International Conference Hall at the Nippon Convention Center near Tokyo.
Source: http://www.xradia.com/