Plasma Enhanced ALD Systems for Nanotechnology Applications

Picosun, a Finland-based global developer of Atomic Layer Deposition (ALD) systems, has started manufacturing plasma enhanced ALD (PEALD) systems from ‘ion-free remote plasma sources.

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It could be used to generate oxygen, nitrogen and hydrogen radicals displaying zero charge to enhance ALD process chemistries.

It could deposit metal and metal nitride thin films at reduced temperatures with activated species. The remote source helps process fragile substrates and delicate device structures without harming the plasma. This is because of low ion count and high reactive species flux. The system can be used for macro and nanotechnology applications.

The Picoplasma source system can either be mounted on the prevailing SUNALE ALD reactors, or installed as a nano deposition unit that is user friendly and cost-effective. It could be fully automated by incorporating it into the Picoplatform cluster tool featuring cassette-to-cassette loading through a vacuum load lock. Features such as rapid matching and stable power supply ensure high outputs with high process speed and film with a uniform thickness of STD 1.3 % with Al2O3 on silicon, from TMA and oxygen radicals and conformality in deep trenches up to AR of 48:1.

Source: http://www.picosun.com