USHIO has introduced its UX4-3Di FFPL 200, the first-of-a-kind 200-mm wafer full-field projection lithography system, for mass production of sophisticated LSI devices featuring three-dimensional integration technologies, including through-silicon via, silicon bumps and interposers.
The UX4-3Di FFPL 200 is the new member of USHIO’s UX4 Series of full-field projection lithography systems. The UX4-LEDs model for mass production of LED chips and the UX4-ECO model for volume-production of power devices are the other models of the company.
UX4-3Di FFPL 200
The UX4-3Di FFPL 200 features a full-field projection lens with a diameter of 200 mm mounted on the common UX4 Series modular platform to allow full-field projection coverage of a 200-mm wafer. This modular platform can be upgraded to enable full-field projection of 300-mm wafers.
The full-field projection lithography system can reach a high output of 120 wafers per hour and provides various functionalities, including the functionality utilized to handle bonded or warped wafers and thick photoresist films, the rear alignment feature and the IR alignment function maximized for producing three-dimensional LSIs. The system is totally a non-contact type to ensure it causes no mask damage.
The UX4-3Di FFPL 200 employs the full-field projection method that allows the system to improve its productivity by increasing the size of the wafer, which in turn reduces operating costs in the process of semiconductor packaging. At present, USHIO is designing a lens module that enables full-field projection exposure of a 300-mm wafer. The company will release this lens module next year.