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New 2D Bilayer Material Helps Realize Graphene Electronics

A research team at Penn State has developed a two-dimensional (2D) bilayer material by integrating one-to-two-atom-thick graphene layer with a hexagonal boron nitride (hBN) layer having a thickness of few to several hundred atoms for fabricating wafer-scale transistors with improved performance.

25 May 2012

Nanotechnology to Address the Limitations of Conventional Solar Cells

Research carried out at Northwestern University, Chicago, has yielded a new solar cell that addresses the limitations of current solar cells.

25 May 2012

Innsbruck Physicists Demonstrate New Interface for Information Transfer from Quantum Networks

The world of communication and information exchange is set to undergo major transformation with advancement in quantum technologies.

25 May 2012

Etron Chooses Analog FastSPICE Nanometer Circuit Verification Platform

Taiwan-based Etron Technologies, which is a fabless Integrated Circuits design and product company has selected Berkeley Design Automation’s Analog FastSPICE(AFS) Platform for verifying the integrity of their memory designs used in consumer and low-power products.

24 May 2012

Indian River State College Establishes Advanced Materials Laboratory in Collaboration with NanoProfessor

The Indian River State College (IRSC) has inaugurated its advance materials laboratory in the premises of its recently established Brown Center for Innovation and Entrepreneurship.

23 May 2012

Samsung Electronics Starts Mass Production of 20-nm-Class 4 Gb LPDDR2 Memory

Samsung Electronics has revealed that mass production of first-of-its-kind 20-nm-class 4 Gb low power double-data-rate 2 (LPDDR2) memory has been started last month.

From Samsung Electronics 19 May 2012

SMIC Inks Deal to Build Expansion Project Operating at 32/28 and 45/40 nm Nodes

Semiconductor Manufacturing International (SMIC), a state-of-the-art semiconductor foundry in China, has reported that its subsidiary SMIC Beijing has inked a cooperation framework document with the Beijing municipal government to establish a joint venture to start SMIC Beijing's second phase expansion project.

16 May 2012

TowerJazz Unveils 180 nm Power Management Analog/Mixed-Signal Reference Design Flow

TowerJazz has introduced a 180 nm power management analog/mixed-signal reference design flow called Reference Flow 2.0 that features Cadence Design Systems’ key technology.

15 May 2012

BT Imaging’s New Production Tools Enable High-Yield Cast Mono Wafers

BT Imaging, a provider of luminescence-based inspection and quality control systems for use in the photovoltaic production industry, has unveiled a suite of production tools that allows photovoltaic wafer manufacturers to communicate and work efficiently with cell manufacturers to achieve the optimal cell efficiency.

14 May 2012